Join IBM, Samsung and GLOBALFOUNDRIES at the Common Platform Technology Forum on February 5. Learn about the latest technological advances being delivered to the world's leading electronics companies.
Real Collaboration = Big Business
At this year's forum, you'll see and hear firsthand from industry leaders how collaborative research and innovative technology development have resulted in an accelerated roadmap for delivery of products you'll see later this year and further into the future.
- Leading-edge process technologies at 32/28-, 20-, 14-nanometer and beyond
- Advanced innovations such as FinFET, design & technology co-optimization, and double patterning
- A peek into the future of next-generation device innovations being researched: silicon nanowires, carbon nanotubes, and 3D device structures
The Common Platform continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Working together with our ecosystem partners, we tackle the most demanding design and manufacturing challenges. We invite you to visit our design, enablement and implementation partners showcasing their solutions in our Partner Pavilion.
Register now for this exciting technical event!