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Future of PCB Manufacturing Looks Brighter with Microelectronics/Wire Bonding

The future of PCB manufacturing is significantly different from our current traditional manufacturing. That's because OEM customers are demanding smaller products, more complex PCBs, and more advanced and powerful technologies in smaller packages.

Hybrid PCB manufacturing today is serving greater numbers of customers advocating this new manufacturing for its products. Hybrid PCB manufacturing includes both conventional SMT assembly and manufacturing inextricably intertwined with microelectronics, otherwise known as wire bonding, CoB, and flip chip assemblies. So, you as the OEM, should expect comprehensive manufacturing solutions.

How do you merge SMT manufacturing with microelectronics manufacturing?

Here are some key pointers:

  • Process intricacies - assure your EMS provider one does not adversely affect the other.
  • Thermal profile considerations - a number of them exist here, but it's critical to assure thermal profiles are created so that both SMT and microelectronics manufacturing are treated adequately.
  • Saving microelectronics working area from SMT area - in short, this means SMT manufacturing tolerances are tight, but not as precise or as controlled as microelectronics. These microelectronics placement areas are to be saved from flux, solder, and other splashes.

In short, you have to double check all the key points associated with each of those PCB manufacturing processes. Otherwise, your advanced product may face some major manufacturing issues at the start or fail in the field.

We have a proven track record for successful SMT and microelectronics manufacturing. Check out our new microelectronics manufacturing video and find out more about how we can effectively perform advanced manufacturing for your new products by visiting www.nexlogic.com.

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