As package density and technology drive the
need for greater density on the printed circuit board, deep
micro-via technology provides several benefits to printed
circuit board designers. Learn more when you request a copy
of Deep Microvias in Next Generation System Design.
Compared to traditional thru-hole vias, microvias
can give printed circuit board designers a distinct advantage
in terms of overall board size reduction, layer count reduction
and increase route or interconnect density. Teradyne's high
performance circuit capabilities
||Deep microvias connecting up to 3 layers
||Buried, blind, back drilled, dual diameter, and electrically
||Panel Sizes 16" x 18" to 24" x 54"
||Layer counts 6 to 60+
||Thicknesses .050" to .440"