Research and Markets ( http://www.researchandmarkets.com/research/drnqw4/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0×3.0×0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Key Topics Covered:
1. Glossary
2. Overview/Introduction , Maxim Company Profile
3. Physical Analysis
Package
- Package Views & Dimensions
- Package Opening
- Wire Bonding Process
- Package Cross-Section
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics
Consumer 6-Axis IMU Comparison
4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
5. Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Wafer & Die Cost
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Front-End Cost per process steps
- MEMS Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- MAX21100 Component Cost
- Consumer 6-Axis IMU Cost Comparison
6. Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/drnqw4/maxim_integrated
Media Contact: Laura Wood, +353-1-481-1716, Email Contact
SOURCE Research and Markets
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