Reverse Costing Analysis of Intel's RealSense 3D Camera & STMicroelectronics IR Laser Projector

DUBLIN, Nov. 2, 2015 — (PRNewswire) — Research and Markets ( http://www.researchandmarkets.com/research/9l5dqs/intel_realsense) has announced the addition of the "Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector - Reverse Costing Analysis" report to their offering.

Logo

Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.

The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640×480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.

The IR laser projector from STMicroelectronics integrates an infrared laser diode, low power class 1, and a resonant micro-mirror manufactured by STMicroelectronics. The projector is tiny, only 11.7mm x 8.4mm x 3.1mm and has a capability of 60fps.

STMicroelectronics has developed an intelligent design to reduce the dimension of the micro-mirror, facilitating its driving and dramacticly reducing the number of manufacturing steps in order to reduce the cost.

Based on a complete teardown analysis of the RealSense 3D Camera and the STMicroelectronics IR Laser Projector, the 2 reports provide the bill-of-material (BOM) and the manufacturing cost of the 3D Camera Module as well as a complete physical analysis and manufacturing cost estimation of the IR Laser Projector.

Key Topics Covered:

1. Introduction - Executive Summary - Reverse Costing Methodology

2. Company Profile

- STMicroelectronics

3. Physical Analysis - Synthesis of the Physical Analysis - Physical Analysis Methodology - RealSense F200 - IR Laser Projector - Package Views, Dimensions & Pin Out - Lens Line - Laser Diode - Resonant Micro-Mirror - View, Dimensions & Marking - Opening - Resonant Micro-Mirror - Comb - Thickness - Bonding

4. Manufacturing Process Flow

- Global Overview

- Micro-Mirror Process Flows

- IR Sensor Wafer Fabrication Unit

- Packaging Process Flows

- Package Fabrication Unit

5. Cost Analysis - Main steps of economic analysis - Yields Hypotheses - Micro-Mirror Front - End Cost - Micro-Mirror Front - End Step Cost - Micro-Mirror Die Cost - Packaging Cost - Component Cost

6. Estimated Price Analysis

- Manufacturer Financial Ratios

- Estimated Selling Price

For more information visit

http://www.researchandmarkets.com/research/9l5dqs/intel_realsense

Media Contact:

Laura Wood, +353-1-481-1716, Email Contact

 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/reverse-costing-analysis-of-intels-realsense-3d-camera--stmicroelectronics-ir-laser-projector-300171027.html

SOURCE Research and Markets

Contact:
Research and Markets
Web: http://www.researchandmarkets.com

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Ansys’ John Lee on Cultivating Trust within his Team
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
The Role of the Portable Stimulus Standard in VLSI Development
Jobs
Design Verification Engineer for Blockwork IT at Milpitas, California
Electrical Engineer - ASIC/FPGA for General Dynamics Mission Systems at Florham Park, New Jersey
Physical Design Engineer (Multiple Openings) for Samsung Electronics at Austin, Texas
Advanced Mechanical Engineer for General Dynamics Mission Systems at Marion, Virginia
Senior Staff Engineer for Samsung Electronics at San Jose, California
FPGA Design Verification Engineer for General Dynamics Mission Systems at Dedham, Massachusetts
Upcoming Events
SEMICON Southeast Asia 2024 at MITEC Kuala Lumpur Malaysia - May 28 - 30, 2024
3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024
2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024
Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise