Nexperia’s New ESD Protection Series for USB Type-C Deliver Industry’s Highest Surge Robustness and Lowest Trigger Voltage

New solutions for USB3.2 SuperSpeed optimized for new system protection configuration

NIJMEGEN, Netherlands — (BUSINESS WIRE) — July 5, 2018Nexperia, the global leader in discretes, logic and MOSFET devices, today announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the system chip.

Nexperia’s TrEOS ESD protection technology uses active silicon-controlled rectification to deliver a winning combination of extremely low capacitance (down to 0.1 pF); extremely low clamping (dynamic resistance down to 0.1 Ω) and very high robustness against surge and ESD pulses (up to 20A 8/20 µs for very fast datalines). Turn-on time is also very fast at about 0.5 ns and devices can withstand up to 30 kV contact discharge, exceeding IEC 61000-4-2, level 4. TrEOS devices for applications where the protection is placed before the capacitor are now available with industry’s leading peak pulse current ratings of 9.5, 15 and 20 A for 8/20 IEC61000-4-5 conditions. TrEOS devices for use after the capacitor similarly deliver industry-leading performance, featuring the lowest trigger voltages (Vt1), down to 4.3 V. These features are also relevant for USB Type-A and MicroUSB interfaces.

Comments Stefan Seider, product manager at Nexperia: “The options offered by USB Type-C and USB Power Delivery are very attractive: To ensure that end customers can enjoy data speeds of up to 20 Gbps and up to 100 W charging, Nexperia offers two TrEOS protection families that support every protection strategy around the new USB3.2 Rx capacitor for protecting sensitive transceivers against possible fault conditions.”

TrEOS protection diodes are packaged in the widely-used 0603 form factor. Advantages of the very compact, very robust DSN0603-2 (SOD962-2) package include the lack of bond wires, which eliminates another failure mode and results in the lowest inductance for fastest protection. This package is very popular for mobile and computing applications. Further space-saving packages are also available. Nexperia has provided a comprehensive parametric USB protection search guide ( click here) to help designers choose the optimal device for their system configuration.

For more information on Nexperia’s TrEOS ESD protection click here.

About Nexperia

Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFET devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 90 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.

With over 50 years history supplying to the world’s biggest companies, Nexperia has over 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.

Nexperia: Efficiency wins.



Contact:

Nexperia
Petra Beekmans, Head of Communications & Branding
Phone: +31 6 137 111 41
Email: Email Contact
or
Agency: BWW Communications
Nick Foot, director
+44-1491-636393
Email Contact

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Ansys’ John Lee on Cultivating Trust within his Team
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
The Role of the Portable Stimulus Standard in VLSI Development
Jobs
Mechanical Design Engineer for Apple Inc at Cupertino, California
Advanced Mechanical Engineer for General Dynamics Mission Systems at Marion, Virginia
Technical Staff Engineer - Hardware (FPGA) for Microchip at San Jose, California
Senior CAD Engineer for Nvidia at Santa Clara, California
Physical Design Engineer (Multiple Openings) for Samsung Electronics at Austin, Texas
Hardware Engineer for PTEC Solutions at Fremont, California
Upcoming Events
SEMICON Southeast Asia 2024 at MITEC Kuala Lumpur Malaysia - May 28 - 30, 2024
3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024
2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024
Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise