Net cash used in investing activities was NT$96.47 billion in 2009, NT$88.43 billion higher than that in 2008, primarily reflecting redemptions of marketable financial instruments in 2008 and the increase in capital expenditures during 2009.
Meanwhile, net cash used in financing activities decreased by NT$29.92 billion to NT$85.47 billion during 2009, mainly due to the absence of repurchase of treasury stock and the reclassification of employee profit sharing from financing activities to operating activities starting 2009, partially offset by the repayment of corporate bonds in the first quarter.
IV - 2. Operating and Free Cash Flows:
Operating and Free Cash Flows:
Cash flows generated from operating activities were NT$62.00 billion during the quarter. Free cash flow, defined as the excess of operating cash flows over capital expenditures, totaled NT$19.29 billion in 4Q09, compared to NT$14.62 billion in 3Q09.
Total free cash flow generated in 2009 was NT$72.19 billion, declined NT$90.08 billion from NT$162.27 billion in 2008. The year-over-year decline was primarily due to lower business activities resulting from the economic downturn and the increased capital expenditures.
Please refer to the link for the index charts: http://www.tsmc.com/uploadfile/ir/quarterly/index_charts.pdf
V. CapEx & Capacity
V - 1. Capital Expenditures
(In US millions) 1Q09 2Q09 3Q09 4Q09 2009 2008
TSMC 161 218 963 1,304 2,646 1,807
XinTec and GUC 2 3 6 1 12 23
TSMC Shanghai & WaferTech 3 3 0 4 10 52
Other TSMC Subsidiaries 0 0 2 1 3 4
Total TSMC 166 224 971 1,310 2,671 1,886
Capital Expenditures:
Capital expenditures for TSMC on a consolidated basis totaled US$1,310 million in 4Q09.
For year 2009, total capital expenditures for TSMC consolidated group totaled US$2.67 billion, compared with US$1.89 billion spent in 2008.
V-2 . Capacity
1Q09 2Q09 3Q09 4Q09 2009 1Q10
Fab / (Wafer size) (A) (A) (A) (A) (A) (F)
Fab-2 (6") Note1 274 280 283 283 1,121 263
Fab-3 (8") 286 289 292 283 1,150 268
Fab-5 (8") 162 149 144 144 599 139
Fab-6 (8") 295 284 287 287 1,154 269
Fab-8 (8") 275 271 265 255 1,066 247
Fab-12 (12") Note 2 218 219 199 243 879 269
Fab-14 (12") Note 2 238 238 239 243 958 255
WaferTech (8") 106 107 109 109 431 106
TSMC China (8") 128 134 135 135 531 132
TSMC total capacity (8"
equiv. Kpcs) 2,431 2,419 2,379 2,467 9,695 2,488
SSMC (8") 64 65 65 65 259 69
Total managed capacity (8"
equiv. Kpcs) 2,495 2,483 2,444 2,532 9,955 2,557
Note: 1. Figures represent number of 6" wafers. Conversion to 8"-
equivalent wafers is obtained by dividing this number by 1.78
2. Figures represent number of 12" wafers. Conversion to 8"-
equivalent wafers is obtained by multiplying this number by 2.25
Capacity:
Total managed capacity was 2,532K 8-inch equivalent wafers in 4Q09, increased by 3.6% from 2,444K in 3Q09. TSMC managed capacity in 1Q10 is expected to increase by 1% to reach 2,557K 8-inch equivalent wafers. 12" wafer capacity will increase by 38K (12''). However, due to scheduled annual maintenance and capacity migration to higher nodes, total legacy fabs capacity will decrease by 60K (8'') in the first quarter of 2010.
Total managed capacity in 2009 reached 9,955K 8-inch equivalent wafers,
representing an increase of 6.2% from 9,377K 8-inch equivalent wafers in 2008,
while capacity for 12-inch wafer fabs increased by 10.8% year-over-year,
reaching 41.5% of total 2009 capacity.
