MILPITAS, Calif. â”� February 24, 2020 – The latest advances in flexible and printed electronics take the spotlight at the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) opening today. FLEX and MSTC 2020 feature keynotes, panels, technical sessions, deep-dive tech talks, networking opportunities and nearly 50 exhibitors with more than 400 attendees. See the full agenda for the four-day events are at the DoubleTree by Hilton Hotel in San Jose, California.

Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group (MSIG), FLEX Sees the Future with 20/20 Vision with cutting-edge flexible and printed electronics applications that deepen interactions between users and their surroundings. The event showcases flexible hybrid and printed electronic products, equipment, processes, materials and applications.

MSTC explores Technologies Driving the Next Wave of Smart MEMS & Sensing Solutions through advances in MEMS and sensors, and highlights market opportunities spurred by artificial intelligence (AI), augmented reality (AR), machine learning (ML), 5G mobile networks and blockchain.

Ajit Manocha, SEMI president and CEO, kicks off the events with his presentation Sensors, MEMS and FHE: Going Beyond Smart to Realize Imagination.

FLEX and MSTC 2020 Keynote Speakers

Four keynotes highlight novel integration and market opportunities for Flexible Hybrid Electronics (FHE), MEMS and sensors as the industry innovates to meet growing consumer demand for more user-centric solutions.

Presentations also include Integrating MEMS Devices in FHE by Nathan Pretorius, printing technology engineer at NextFlex. See related blog MEMS-FHE Device Integration Gets Real.

Other FLEX and MSTC 2020 highlights include:

• Diversity – Women in Tech, a discussion today about diversity and mentoring in the electronics design and manufacturing industry
• Annual FLEXI Awards honoring organizations and individuals for innovation and commercialization, research and development, and education leadership
• University student poster session highlighting flexible electronics, MEMS and sensors projects
• NextFlex Technology Hub tour where attendees will witness design, prototyping and pilot-scale manufacturing of FHE next-generation electronics that bend, flex and stretch

About SEMI

SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter. 



Contact:

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: Email Contact