Juliano Mologni, Lead Product Manager ANSYS

Chris Williams, Head of European Sales Solderstar

Nando Basile, Marketing Director - eNVM solutions X-FAB

EDACafe Editorial by Roberto Frazzoli Synopsys to sell Software Integrity Group; Micron to get CHIPS Act funding; 3D solution for RFSOI; recyclable PCBs

Siemens EDA by Jean-Marie Brunet The Strategic Advantage in the Hardware-assisted Verification Segment

Bridging the Frontier by Bob Smith, Executive Director Ansys’ John Lee on Cultivating Trust within his Team

The Dominion of Design by Sanjay Gangal TSMC Unveils Next-Gen AI Semiconductor Technologies at 30th North America Symposium

Agnisys Automation Review by Anupam Bakshi The Role of the Portable Stimulus Standard in VLSI Development

Advanced Mechanical Engineer for General Dynamics Mission Systems at Marion, Virginia

Electrical Engineer - ASIC/FPGA for General Dynamics Mission Systems at Florham Park, New Jersey

RF Design Engineer for Blockwork IT at San Francisco, California

Mechanical Design Engineer for Apple Inc at Cupertino, California

Senior CAD Engineer for Nvidia at Santa Clara, California

Hardware Development Engineer - (PCB) for Cisco Systems Inc at Austin, Texas

SEMICON Southeast Asia 2024 at MITEC Kuala Lumpur Malaysia - May 28 - 30, 2024

3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024

2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024

Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024