DVCon U.S. 2021 Provides Outstanding Technical Program on Virtual Platform

Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC

Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems

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Silanna Semiconductor Powers the Highest Performance Fast Charging AC/DC Power Adapters

VAST Data Unveils Joint Reference Architecture with NVIDIA Designed to Significantly Increase Storage…

EPC Releases Physics-Based Models That Project eGaN® Device Lifetime in New Reliability Report

Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to…

Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Proces…

Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks

QuickLogic's Talk on Open Source FPGA Tooling

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Product Line Manager for EDA Careers at Multiple, North Carolina

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Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021

Hitendra Divecha & Brandon Bautz Cadence

EDACafe Editorial by Roberto Frazzoli Intel’s new CEO: comments from media and analysts

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IC Insights by IC Insights Industry R&D Spending To Rise 4% After Hitting Record in 2020

Embedded Software by Colin Walls Libraries – a good way to promote embedded code reuse?

Bridging the Frontier by Paul Cohen Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B

Mixel, Inc. - MIPI C-PHY/D-PHY Combo IP Universal, 4.5Gsps/4.5Gbps

Secantec, Inc. - Reed Solomon Code for Error Correction

T2M - DDR4/LPDDR4 Combo PHY with Matching DDR4 Controller

Synopsys - DesignWare USB4 PHY IP in TSMC (N5, N6)

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