Welcome to the World’s only online conference in Semiconductor Industry VSDOpen Conference 2019. With enormous support and global presence of audience from different segments of industrial lobby and academia made VSDOpen 2018 a highly successful event. Evolution is change in the genetic makeup of a population over time, online conference is one kind evaluation everyone adapt soon.
VSDOpen 2019 is free to attend! Anyhow, you must Register, so that we can plan better.
The Linley Group presents the annual Linley Fall Processor Conference at the Hyatt Regency in Santa Clara, California on October 23-24. This two-day event features technical presentations – including new product disclosures, and panel discussions -focusing on the processors and IP cores used in AI applications, embedded, data center, automotive, IoT, and communications. Sessions include:
Attendance is free to qualified registrants who sign up by Oct 17. The conference is intended for chip designers, system designers, equipment vendors, OEM/ODMs, service providers, press, and the financial community.
The Design and Verification Conference (DVCon) Europe is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative™, DVCon Europe brings chip architects, design and verification engineers, and IP integrators the latest methodologies, techniques, applications and demonstrations for the practical use of EDA solutions for electronic design. One of four DVCon events around the globe, DVCon Europe 2019 will include 2 keynote speeches, panel sessions, a broad range of papers and posters, 16 tutorials and an exhibition with demonstrations from leading tool, IP and service providers.
The SOI Consortium’s 4th annual Japan Symposium will take place in Yokohama on October 30th and 31st (just after the Silvaco SURGE users’ conference). Both days cover the SOI ecosystem, use cases, design, EDA tools and IP: the first day for FD-SOI and RF-SOI; the second day for photonics and power. Registration to these events are free, but please be sure to register in advance as capacity is limited.
Future success of the industry depends on the ability to ensure that customer expectations for reliability are fully met throughout the life of the product. Proper thermal and stress budgeting has always been and will continue to be paramount to the success of the microelectronics industry in designing and manufacturing next generation electronics. It includes such products as 3D IC based on heterogeneous integration of functionally diverse components, strain engineered devices, etc. Reliability of new emerging electronic materials and devices operating in harsh and extreme environments become ever more challenging. Next generation of energy storage materials that are both smart and sustainable, flexible electronics for stretchable and wearable devices and technologies - these are just a few examples of new areas to be explored. Thermal-mechanical reliability must be optimized and designed into products and processes using advanced physics-based models and reliability-aware design methodologies.
IRSP 2019 provides a forum for presenting cutting-edge research and discussions on how to address the coupled electro-thermal-mechanical complexities in materials, devices, circuits, packages, and systems that crucially affect the design and technology of electronics products now and in the future.
What does the future of computing hold? Join IEEE at Rebooting Computing Week 4-8 November 2019 in San Mateo, CA, USA to hear industry leaders from Microsoft, Google, D-Wave Systems Inc., and many others discuss topics including Quantum, Artificial Intelligence, Large-Scale Systems, Moore’s Law, and more. You will get an interdisciplinary look at what to expect next year, in 5 years and even for the next 20-30 years of computing.
At present, in order to deal with the future passenger cars and commercial vehicles on the system demand for higher data throughput, the major vendors are developing scalable type electrical architecture. Although now the CAN network has begun to take on more, but because of the future vehicle sensor data will be a lot more than they are now, the bandwidth of the CAN bus architecture and throughput are relatively limited, difficult to deal with the future vehicle in data stream processing, network security and the demand of "ultimate" machine learning, etc. Develop the next generation of electronic electrical architecture has become the inevitable trend.Under the background of the "China automobile electronic electrical architecture innovation development BBS 2019" will be on November 7, 2019-8 was held in Shanghai. This BBS will invite 200 + leading automakers from around the world, the level of supplier, architecture consulting development company, electronic electrical equipment manufacturers, software vendors, chip makers, shell processing and manufacturing, for automobile wiring harness and connectors to discuss automation, electrification, interconnection of future intelligent electronic electrical architecture design, develop a set of optimal solutions, in order to realize the development of various functions of the vehicle.
There are plenty of good reasons for you to attend productronica. After all, in this form, productronica is unique in the world of electronics production.
productronica is THE leading international trade fair for the development and manufacture of electronics. It is the only place in the world where you can find the entire value chain in electronics manufacturing under a single roof – from software to process control, from technologies to applications, and from products to system solutions.
