Events - Next 30 Days

Search:
Submit Events

VSDOpen 2019 Conference
Date: October 19, 2019
Place: India

Welcome to the World’s only online conference in Semiconductor Industry VSDOpen Conference 2019. With enormous support and global presence of audience from different segments of industrial lobby and academia made VSDOpen 2018 a highly successful event. Evolution is change in the genetic makeup of a population over time, online conference is one kind evaluation everyone adapt soon. 

  • VSDOpen 2019, we are bringing you more interesting work done in RISC-V domain and Open Source EDA tools.  
  • Industry and Academic research talks about the chip designed and developed using RISC-V ISA from IIT Madras India and SweRV from Western Digital.
  • First of its kind, Virtual Booth to Demonstrate the working RISC-V Chip and Board developed in complete Open source domain.

VSDOpen 2019 is free to attend! Anyhow, you must Register, so that we can plan better.

 
SMTA Guadalajara 2019
Date: October 23 - 24, 2019
Place: Expo Guadalajara
Guadalajara,, Mexico
 
Linley Fall Processor Conference
Date: October 23 - 24, 2019
Place: Hyatt Regency Santa Clara
5101 Great America Pkwy, Santa Clara, CA 95054 USA

The Linley Group presents the annual Linley Fall Processor Conference at the Hyatt Regency in Santa Clara, California on October 23-24. This two-day event features technical presentations – including new product disclosures, and panel discussions -focusing on the processors and IP cores used in AI applications, embedded, data center, automotive, IoT, and communications. Sessions include:

  • Data Center Technologies 
  • AI at the Edge
  • Accelerating AI SoCs
  • AI in the Data Center
  • SoCs for Edge Devices
  • AI for IoT Devices
  • Security
  • AI in Automotive

Attendance is free to qualified registrants who sign up by Oct 17. The conference is intended for chip designers, system designers, equipment vendors, OEM/ODMs, service providers, press, and the financial community.

Silvaco SURGE Silicon Valley, Oct. 24
Date: October 24, 2019
Place: 2811 Mission College Blvd.
6th floor, Santa Clara, CA 95054 USA
 
 
SURGE (Silvaco UseRs Global Event) brings together users, developers, and industry experts of the EDA, IP, and TCAD communities to discuss new semiconductor technologies, smart integration for innovative applications, and new techniques for realizing advanced designs.
  • Executive keynotes
  • Technology Tracks: TCAD, EDA, and Design IP
  • Roadmap presentations
  • Customer and partner presentations and success stories
  • Eight unique demo stations
  • Networking with industry experts
DVCon Europe 2019
Date: October 29 - 30, 2019
Place: Holiday Inn Munich City Center
Munich, Germany

The Design and Verification Conference (DVCon) Europe is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative™, DVCon Europe brings chip architects, design and verification engineers, and IP integrators the latest methodologies, techniques, applications and demonstrations for the practical use of EDA solutions for electronic design. One of four DVCon events around the globe, DVCon Europe 2019 will include 2 keynote speeches, panel sessions, a broad range of papers and posters, 16 tutorials and an exhibition with demonstrations from leading tool, IP and service providers.

Japan SOI Symposium
Date: October 30 - 31, 2019
Place: Yokohama Landmark Tower
Yokohama, Japan

The SOI Consortium’s 4th annual Japan Symposium will take place in Yokohama on October 30th and 31st (just after the Silvaco SURGE users’ conference). Both days cover the SOI ecosystem, use cases, design, EDA tools and IP: the first day for FD-SOI and RF-SOI; the second day for photonics and power. Registration to these events are free, but please be sure to register in advance as capacity is limited.

16th International Conference on Reliability and Stress-related Phenomena in Nano and Microelectronics
Date: November 4 - 6, 2019
Place: 46871 Bayside Parkway
Fremont, 94538 USA

Future success of the industry depends on the ability to ensure that customer expectations for reliability are fully met throughout the life of the product. Proper thermal and stress budgeting has always been and will continue to be paramount to the success of the microelectronics industry in designing and manufacturing next generation electronics. It includes such products as 3D IC based on heterogeneous integration of functionally diverse components, strain engineered devices, etc. Reliability of new emerging electronic materials and devices operating in harsh and extreme environments become ever more challenging. Next generation of energy storage materials that are both smart and sustainable, flexible electronics for stretchable and wearable devices and technologies - these are just a few examples of new areas to be explored. Thermal-mechanical reliability must be optimized and designed into products and processes using advanced physics-based models and reliability-aware design methodologies.

IRSP 2019 provides a forum for presenting cutting-edge research and discussions on how to address the coupled electro-thermal-mechanical complexities in materials, devices, circuits, packages, and systems that crucially affect the design and technology of electronics products now and in the future.

 

IEEE Rebooting Computing Week
Date: November 4 - 8, 2019
Place: 1770 S Amphlett Blvd.
San Mateo, CA 94402 USA

What does the future of computing hold? Join IEEE at Rebooting Computing Week 4-8 November 2019 in San Mateo, CA, USA to hear industry leaders from Microsoft, Google, D-Wave Systems Inc., and many others discuss topics including Quantum, Artificial Intelligence, Large-Scale Systems, Moore’s Law, and more. You will get an interdisciplinary look at what to expect next year, in 5 years and even for the next 20-30 years of computing.

IAR DevCon
Date: November 5, 2019
Place: Biltmore Hotel and Suites
Santa Clara, CA USA
 
Automotive E/E Architecture China Conference 2019
Date: November 7 - 8, 2019
Place: Renaissance Shanghai
Shanghai putuo district tongchuan road no. 50, Shanghai, 200333 China

At present, in order to deal with the future passenger cars and commercial vehicles on the system demand for higher data throughput, the major vendors are developing scalable type electrical architecture. Although now the CAN network has begun to take on more, but because of the future vehicle sensor data will be a lot more than they are now, the bandwidth of the CAN bus architecture and throughput are relatively limited, difficult to deal with the future vehicle in data stream processing, network security and the demand of "ultimate" machine learning, etc. Develop the next generation of electronic electrical architecture has become the inevitable trend.

Under the background of the "China automobile electronic electrical architecture innovation development BBS 2019" will be on November 7, 2019-8 was held in Shanghai. This BBS will invite 200 + leading automakers from around the world, the level of supplier, architecture consulting development company, electronic electrical equipment manufacturers, software vendors, chip makers, shell processing and manufacturing, for automobile wiring harness and connectors to discuss automation, electrification, interconnection of future intelligent electronic electrical architecture design, develop a set of optimal solutions, in order to realize the development of various functions of the vehicle.

productronica 2019
Date: November 12 - 15, 2019
Place: Neue Messe München
Munich, Germany

There are plenty of good reasons for you to attend productronica. After all, in this form, productronica is unique in the world of electronics production.

productronica is THE leading international trade fair for the development and manufacture of electronics. It is the only place in the world where you can find the entire value chain in electronics manufacturing under a single roof – from software to process control, from technologies to applications, and from products to system solutions.

Aldec

Featured Video
Jobs
Senior Software Engineer for Abaco Systems Inc at Huntsville, Alabama
Sr. Electrical Hardware Project Engineer for Stellartech Research Corp at Milpitas, California
Senior Hardware Engineer for Abaco Systems Inc at Austin, Texas
Principal Engineer, Firmware Engineering for Western Digital at Milpitas, California
Mid to Senior Level Electrical Engineer for Gordon Prill, Inc at Santee, California
Upcoming Events
VSDOpen 2019 Conference at India - Oct 19, 2019
Linley Fall Processor Conference at Hyatt Regency Santa Clara 5101 Great America Pkwy Santa Clara CA - Oct 23 - 24, 2019
SMTA Guadalajara 2019 at Expo Guadalajara Guadalajara, Mexico - Oct 23 - 24, 2019
Silvaco SURGE Silicon Valley, Oct. 24 at 2811 Mission College Blvd. 6th floor Santa Clara CA - Oct 24, 2019



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise