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Saturday, December 15, 2018
What's New on EDACafe
The Design Automation Conference Secures a Five-Year Conference Location at San Francisco’s Moscone Center
Dassault Aviation welcomes decision of Indian Supreme Court
TE Connectivity to showcase high-speed Innovations at DesignCon 2019
Ventec Extends tec-speed 20.0 Series of Low PIM Antenna-Grade Laminates
Why should IC design startups opt for startup EDA tools in a cloud?
Congress on the Future of Engineering Software (COFES) Announces 2019 Event in Silicon Valley
Bluespec, Inc. Releases a Second Family of Open-Source RISC-V Processors to Spur Open Innovation
Cirrus Logic Names Synopsys’ Deirdre Hanford to Board of Directors
More EDA News
Embedded, IP & SoC News
SiFive Recognized as Most Respected Private Semiconductor Company
Intel Editorial: Study Considers Applying Emerging Technology to Solve Environmental Challenges
Molex Demonstrates Strength in Autonomous Vehicle Design with Enhanced Automotive Ethernet Network P…
ROHM's New LTR50 Series of Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistors Delivers Industry-Leading…
Amkor Offers Optical Package Solutions for Multiple Applications
TYAN Introduces Entry Server Platforms Optimized for the New Intel® Xeon® E-2100 Processors
Unleash the Full Power of AMD Radeon™ GPUs with New AMD Radeon™ Software Adrenalin 2019 Edition…
Micron Delivers Industry’s Highest-Capacity Monolithic Mobile Memory for MediaTek’s Newest Helio…
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Latest Blog Posts
by Colin Walls
Embedded file systems
by Sanjay Gangal
Verific Celebrates 20 years in the SystemVerilog and VHDL Parser Business
by Roberto Frazzoli
Major stories this week: Interconnect fabric, RISC-V ecosystem, ARM Neoverse, USB4
Bridging the Frontier
by Bob Smith, Executive Director
Registration Opens for the Inaugural ES Design West
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Northwest Logic Inc.
- PCI Express™ 5.0 specification compliant - backward compatible with …
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