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Title : Robust System Thermal Management
Company : Cypress Semiconductor Corp.
Date : 17-Apr-2011
Downloads : 3

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Today, process technology has advanced to 32nm, resulting in an increase in the number of transistors per unit area and a reduction in package size. At the same time, system designers are trying their best to reduce the system size by increasing the component density on boards, adding as many features in the design as possible to deliver the industries’ best products in terms of space and size. Increased transistor density inside the chip, higher operating speeds, and increased component density on board in modern electronic systems has led to relatively more heat being generated in these systems. All this has made thermal management an integral and critical part of system management in all application domains, including automotive, industrial control, consumer electronics, battery powered systems, and so on. Many systems are equipped with cooling fans to deal with the heat generated. This has led designers to realize the need to come up with cost-effective, reliable, noise-free, and power efficient temperature-based closed loop fan control systems.
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