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Title : Improving Design Reliability by Avoiding EOS
Company : Mentor Graphics
Date : 16-Sep-2013
Downloads : 101



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With the advent of more complex design requirements and greater variability in operating environments, electrical overstress (EOS) is one of the leading causes of IC failures across all semiconductor manufacturers, and is responsible for the vast majority of device failures and product returns. Learn how Calibre PERC can help you:
  • Understand voltages at the pin level without SPICE simulation
  • Avoid EOS and identify oxide-breakdown conditions
  • Improve reliability and reduce verification time

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This is very important review found here. site - khanse9 - Report As Inappropriate
The goal here is to reduce marginal devices that have construction deficiencies, including wire-bond errors, oxide-layer faults, and metallization spots. essay writing company After burn-in measurement, the element is tested electrically to resolve whether its parameters have discredited and to consider its properties. - David Allen - Report As Inappropriate
Downstream : Solutuions for Post processing PCB Designs

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