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Title : Die Level Process Monitors and Test Structures
Company : Ridgetop Group, Inc.
File Name : Ridgetop Die Level Test Structures.pdf
Size : 3146453
Type : application/pdf
Date : 04-May-2010
Downloads : 49

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In the silicon debug process, the basic question needs to be answered; do I have a process problem or a design problem? Unlike conventional ring oscillator based, scribe line based structures, Ridgetop's patented approach provides fabless semiconductor firms with effective tools to help accelerate silicon debug. Ridgetop's proven die level test structures allow more precise monitoring and troubleshooting for advanced IC design. Self-contained and occupying minimal space, the structures can be used to measure critical mismatch parameters and the extent of NBTI effects (intermittencies).
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Downstream : Solutuions for Post processing PCB Designs

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