AUSTIN, Texas — (BUSINESS WIRE) — October 13, 2011 — Silicon Integration Initiative (Si2) announced today its sponsorship of the “3-D Architectures for Semiconductor Integration and Packaging Conference.” This conference will be held December 12-14, 2011, at the Hyatt Regency San Francisco Airport Hotel in Burlingame, CA, and is organized by RTI International.
“Si2's member companies recognize the growing business need for designing and integrating circuits in 3-D chip assemblies, as well as the technical challenges that must be solved to support them," says Sumit DasGupta, sr. vice-president of engineering at Si2. "Many of our member companies and other interested parties have also realized the growing importance of standards to enable interoperable design floes and have asked Si2 and other standards organizations to develop new standards in 3-D design flows. In response to industry request, Si2 has recently formed an Open3D Technical Advisory Board to address those concerns."
3-D integration and packaging could very well be approaching an inflection point. Within the past year alone, there have been several major announcements regarding new 2.5-D, 3-D and TSV manufacturing efforts. Certainly there are obstacles remaining, but the alternatives available to the industry are comparatively far more challenging. Additionally, many believe the 3-D integration approach will ultimately offer entirely new market opportunities with new systems capabilities beyond what is currently possible with 2-D manufacturing approaches. There remains a natural degree of uncertainty as companies work to secure a technology position, obtain new process and design tools, and of course, new customers and new applications.
This conference continues to give a broad, yet thorough, perspective on the market opportunity and challenge offered by building devices and systems in the vertical dimension. Registration and additional information is available at: http://techventure.rti.org/index.html.
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 23rd year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.
Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304