Si2 Announces Six New Members of the Open3D Technical Advisory Board

Multiple Standards Being Developed to Enable 2.5D and 3D Design Flows

AUSTIN, Texas — (BUSINESS WIRE) — May 31, 2012 — The Silicon Integration Initiative (Si2) announced today six additional members of their Open3D Technical Advisory Board (TAB), which is chartered to enable interoperable 2.5D and 3D design flows with open standards, providing common formats and interfaces. The new members of the Open3D TAB are: Altera, AMD, IBM, Helic S.A., SEMATECH, and STARC. There are now 18 companies and organizations participating in the Open3D TAB.

Current working groups for Open3D TAB members include developing standards to support:

  • Definition of the power distribution network across the die of a 3D stack, a topic for which a contribution has already been received in response to the request for technology (RFT) that was released earlier in the year
  • Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
  • Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process

“3D implementation presents difficult and complex challenges that will require the development and adoption of standards,” said Raj Jammy, SEMATECH's vice president of Emerging Technologies. “This partnership aims to fill that space with a complementary effort to enable successful commercialization of 3D ICs.”

“The Open3D TAB is making excellent progress and gaining significant momentum, as evidenced by the new members who have recently joined the TAB,” said Dr. Sumit DasGupta, Sr. Vice President of Engineering, Si2. “Member companies have made key technical donations in areas such as the Chip Interface Protocol description for power distribution network analysis from ANSYS and the requirements documents from SRC for power distribution networks and thermal analysis. We invite others in the industry to join this effort.”

At the upcoming Design Automation Conference in San Francisco, Si2 will be presenting a session on “Standards for a 3D World.” This will be on June 4 in Room 301 of the Moscone Center from 3:15 PM – 4:30 PM. This session will include a presentation of status of activities in the 3DTAB followed by a panel discussion which will include industry experts who will present some of the issues being addressed now and also cover some of the future challenges. For more information and free registration, click here: http://www.si2.org/?page=1525

For more information on the Open3D TAB, click here: http://www.si2.org/?page=1380

Membership in Si2 project is open to all interested parties across the semiconductor supply chain. For more information see: http://www.si2.org/?page=1137

Open3D TAB Members:

Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ: ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, IBM (NYSE: IBM), Intel (NASDAQ: INTC), Helic S.A., Invarian, Mentor Graphics (NASDAQ: MENT ), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STARC, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 24th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 90 companies involved in all parts of the silicon supply chain through out the world. See: www.si2.org.



Contact:

Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304




Review Article Be the first to review this article
Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! SEMI’s Innovation for a Transforming World
intelThe Dominion of Design
by intel
The Long Game: Product and Security Assurance
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Setting a High Standard for Standards-Based IP
Jobs
SerDes Applications Design Engineer for Xilinx at San Jose, California
Test and Measurement System Architect for Xilinx at San Jose, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Upcoming Events
Innovation for a Transforming World -virtual Event at United States - Jul 13 - 14, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise