SENSIO and leading Chinese TV manufacturer working together to give rich and immersive 3D viewing to consumers

Qingdao, China and MONTREAL, Canada — August 22nd, 2012 — Hisense Electric Co.,Ltd (HEC) (SHSE: 600060), a major electronic technology and home appliances company in China, and SENSIO Technologies Inc. (SENSIO) (TSX-V: SIO), a pioneer in 3D-image processing, today announced that they have reached an agreement for the integration of SENSIO Hi-Fi 3D and SENSIO S2D Switch in Hisense 3DTVs. As the largest subsidiary in the Hisense Group, HEC possesses the most advanced DTV production lines in China and has an annual output of 16.1 million color TVs. The agreement between these two cutting edge companies covers every market around the world.

“Working with SENSIO and adopting its premium-quality technologies will definitely bring an added value to our products and will provide the highest 3D experience to our customers,” said Shao Jiancheng, HEC vice General Manager. “Furthermore, SENSIO’s format is a decisive component to distinguish ourselves from the competition in terms of quality and innovation. We are convinced that combining efforts and expertise with a company as innovative and dynamic as SENSIO will definitely enhance our international influence as well as our strategic positioning in the 3D industry.”

SENSIO Hi-Fi 3D is a unique frame-compatible technology for high-fidelity stereoscopic signal processing easily integrated into display products. Developed and refined by SENSIO for more than a decade, and deployed in the field for seven years, this mature technology has been trusted by the biggest names in content creation for pioneering and commercializing live 3D events in cinemas around the world, as well as for high-profile console games and VoD 3D movies service.

The proprietary SENSIO S2D Switch, which is protected by US and international patents, enables users to switch viewing mode of a 3D feed from 3D to 2D or between different 3D view modes. It supports the most popular frame-compatible formats covered by HDMI 1.4a, and is used by service providers supporting 3D today: side-by-side (SbS), top-and-bottom (TaB), and SENSIO Hi-Fi 3D.

“We are thrilled to have signed this agreement with Hisense, a true leader in the Chinese consumer electronics market. It is a significant recognition of the high quality of our format and confirms our leading position in China, one of the utmost priorities for SENSIO in the near future,” said Nicholas Routhier, SENSIO president and CEO. “Moreover, this agreement is an additional confirmation of the relevance of our System on Chips (SoC) strategy. By integrating our SENSIO Hi-Fi 3D decoder in the most popular chips, we have reduced the sales cycle significantly and made it very easy for CE manufacturers to support our award-winning format. This is one of the reasons behind our recent successes and we are very optimistic about the months to come.”


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