Nano2017 is a five-year public-private strategic R&D program, led by ST, which gathers many players, including the leading French research laboratory CEA-LETI -a historical partner of the ST Crolles R&D center since its set up in 1992-, several University research teams, material and equipment manufacturers, vendors and CAD intellectual property specialists, system integrators, and other European stakeholders and Small and Medium Enterprises (SMEs). The project is supported by French national, regional and local authorities as well as by the European community through the ENIAC Joint Technology Initiative (JTI). Funding for the program is subject to approval by the European Commission.
Nano2017 strengthens ST's leadership in key technologies: FD-SOI(1) (low-power, high-performance processing), next-generation imaging (sensors and image signal processors)(2) and next-generation embedded non-volatile memories(3). These technologies are at the core of ST's embedded processing solutions which include microcontrollers, imaging solutions, digital consumer products, application processors and digital ASICs. Embedded processing technologies and products are developed mainly in the French sites of Crolles, Grenoble, Rousset and Sophia Antipolis. ST currently addresses an estimated $67 billion market(4) in 2013 for embedded processing solutions and has significant potential to grow and gain market share.
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on ST can be found at www.st.com
(1) FD-SOI (Fully Depleted-Silicon on Insulator) is a next-generation process technology that addresses most of the challenges caused by continuing to shrink the features of transistors to dimensions measured in the 10s or 100s of atoms. Because of leakage, current silicon process technology is increasingly inefficient at 28nm and below. FD-SOI is a faster, cooler and simpler alternative.
(2) Developments in imaging sensors and image signal processing are expected to enable extraordinary applications that see, for energy efficiency, security, convenience and health. Imagine TV screens that power down when you look away, vehicles and residences that recognize their owners and medical equipment that recognize unusual growth. These will all be possible with advances in imaging.
(3) An Embedded Non-Volatile Memory (eNVM) is an important component of almost all systems-on-chips. The eNVM operates as an on-chip program or data storage locker, where the system can safely store firmware, security-code, calibration data, and other application-critical information-even when the system is not being powered.
(4) Source: WSTS
ST Nano 2017 PR: http://hugin.info/152740/R/1717863/571329.pdf
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