Microsemi Wins EDN China's Innovation Award for its SmartFusion2 SoC FPGA

ALISO VIEJO, Calif., Nov. 13, 2013 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was the recipient of EDN China's 2013 Innovation Award for "Best Product" in the Programmable Logic Devices category for its SmartFusion®2 System-on-Chip (SoC) field programmable gate array (FPGA). The EDN China Innovation Awards have become one of the region's most anticipated and respected accolades for the electronic design industry.

"The Microsemi team is honored that EDN China, one of China's most prestigious electronic design magazines, has recognized our SmartFusion2 SoC FPGA with its Innovation Award," said Anthony Hsiah, Microsemi's country manager China. "This product continues to receive recognition from some of the most well respected organizations across the globe, validating Microsemi's ability to deliver the mainstream FPGA features designers need with the industry's highest reliability, best-in-class security and lowest power."

Technical experts and senior EDN China editors evaluated finalists and selected the best products that deliver innovative design ideas and technological features. EDN China readers and registered online users also voted for finalists based on technological innovation, market influence and related product service.

Microsemi and other award winners were announced on Nov. 12, 2013 during an awards ceremony at the Shanghai Pudong Holiday Inn Kangquiao in Shanghai.

About Microsemi's Award-winning SmartFusion2 SoC FPGAs
Microsemi's next-generation SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® CortexTM-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its EDN China's 2013 Innovation Award for "Best Product" in the Programmable Logic Devices category for its SmartFusion2 SoC FPGA device, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

MSCCP

SOURCE Microsemi Corporation

Contact:
Microsemi Corporation
Gwen Carlson, Director of Corporate Communications,949.380.6135
Beth P. Quezada, Communications Specialist, 949.380.6102
Email Contact
Web: http://www.microsemi.com




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