Combined CMOS-DMOS Process Reduces Heat Generation by 30%
TOKYO — (BUSINESS WIRE) — December 8, 2013 —
Corporation (TOKYO:6502) today announced the launch of TC7761WBG,
a wireless power receiver IC that complies with Qi Standard1
Low Power Specifications version1.1, defined by the Wireless Power
Consortium (WPC). The IC will be used in wireless power supply
applications, such as smartphones and mobile accessories. Mass
production shipments start today.
ICs used in mobile applications including smartphones, are required to generate heat at low level, to prevent overheating. The TC7761WBG is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70% that of an equivalent product2 while achieving 95% power conversion efficiency. The ICs built-in protocol authentication circuit eliminates the need for an external microcontroller, contributing to simplification of the system.
Toshiba: "TC7761WBG", a wireless power receiver IC that complies with Qi Standard Low Power Specifications version1.1. (Photo: Business Wire)
Key Features of New Product
- Reduces heat generation by 30%.
- Achieves 95% maximum power conversion efficiency.
- Integrates protocol authentication circuit of Qi standard
- Complies with Qi Low Power Specifications version1.1 that includes FOD (Foreign Object Detection) function.
- Awarded Qi certification at output power of 3.5W.
Mobile devices such as smartphones and mobile accessories
|Transmission Method||Electromagnetic induction method (Qi standard)|
3.5W (Qi certified）
|Sample Price||300yen (Tax included)|
1: The international standard for wireless charging, defined by the Wireless Power Consortium.
2: Comparison with TB6862WBG.