Media Alert: Cadence to Showcase Signal Integrity Solutions for System-Level, Power-Aware Multi-Gigabit Interface Compliance at DesignCon 2016

Demos to include latest PCIe 4.0 multi-link and multi-protocol PHY addressing requirements of datacenter, server and storage markets

SAN JOSE, Calif., Jan. 13, 2016 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced plans to exhibit its latest Sigrity™ signal analysis and power integrity technologies for system-level, power-aware multi-gigabit interface compliance during this year's DesignCon at booth 515 from January 19 to 21, 2016, in Santa Clara, Calif.

Cadence Logo

Cadence also plans to demonstrate the latest multi-link and multi-protocol PHY for PCI Express® (PCIe®) 4.0 to address the requirements of the datacenter, server and storage markets. This next-generation PHY provides the flexibility of mixing networking protocols with a single macro and offers long reach and high-power efficiency for green datacenters.

To register for the conference, visit

The following demonstrations are scheduled for the show:

  • Constraint-driven power integrity design and analysis featuring decoupling capacitor (decap) placement guidance and design rule check (DRC) markers located where IR drop is not within pre-defined specifications
  • Power-aware memory interface design and analysis of the latest DDR and LPDDR interfaces
  • Multi-gigabit serial link design and analysis featuring compliance tests for PCIe, MIPI and USB
  • PCIe 4.0 multi-link and multi-protocol PHY to address requirements of the datacenter, server and storage markets

In addition, experts from Cadence are scheduled to deliver several speaking sessions to discuss new developments in these technologies and how they can help solve today's signal integrity challenges. The Cadence® speaking sessions planned are:

  • Panel: Reducing Noise in Power Distribution Networks on Time and in Budget: Tuesday, January 19, 4:45pm6:00pm, Sam Chitwood, product engineer
  • Access to 3D Electromagnetic (EM) Simulation—For Those Who Care and Those Who Couldn't Care Less: Wednesday, January 20, 1:45pm2:25pm, Brad Brim, product engineering architect
  • Learn How to Turn Simulation into Reality for PAM4 Analysis: Wednesday, January 20, 2:50pm3:30pm, Ken Willis, product engineering director
  • Panel: Needs and Capabilities for Modeling of Capacitor Derating: Wednesday, January 20, 3:45pm5:00pm, Sam Chitwood, product engineer and Brad Brim, product engineering architect
  • Novel Power Integrity (PI) Flow Driven Using Powertree for Easier Data Visualization and Automation: Thursday, January 21, 10:15am10:55am, Mike Kang, senior staff engineer; Sam Chitwood, product engineer; Dennis Nagle, product engineering architect; Jingping Zhang, engineering R&D group director; and Dingru Xiao, product engineer
    Block-Level Modeling-Based Power and Signal Integrity Performance Optimization of Integrated Core and Memory System: Thursday, January 21, 11:05am11:45am, Zhen Mu, principal engineer
  • Panel: Target Impedance and Rogue Waves: Thursday, January 21, 3:45pm5:00pm, Brad Brim, product engineering architect

January 19 – 21, 2016

Booth 515 at DesignCon 2016
Santa Clara Convention Center
5001 Great America Parkway, Santa Clara

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at

© 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence and the Cadence logo are registered trademarks and Sigrity is a trademark of Cadence Design Systems, Inc. in the United States and other countries. PCI Express and PCIe are registered trademarks of PCI-SIG. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
Email Contact

Logo -


To view the original version on PR Newswire, visit:

SOURCE Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

Review Article Be the first to review this article
Featured Video
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Breaking Down Chip Design Functional Verification with Breker’s Adnan Hamid
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Welcome Back to DAC – in Person – in San Francisco
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Why Automate Traceability?
Business Operations Planner for Global Foundaries at Santa Clara, California
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
CSM Design Verification Lead for Apple Inc at Cupertino, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Upcoming Events
67th Annual IEEE International Electron Devices Meeting at Hilton San Francisco Union Square hotel San Francisco - Dec 11 - 15, 2021
67th Annual International Electron Devices Meeting at Hilton San Francisco Union Square Hotel San Francisco, CA - Dec 13 - 15, 2021
DVCon India 2021 at India - Dec 14 - 16, 2021
SEMICON Japan 2021 Hybrid at Tokyo Big Sight / Online Tokyo Japan - Dec 15 - 17, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise