Morfis Semiconductor Announces Availability of Family of World’s Smallest Fully Integrated CMOS Single-Die Flip-Chip LTE/3G RF Front-End Solutions

IRVINE, Calif. — (BUSINESS WIRE) — January 19, 2016 — Morfis Semiconductor today announced the availability of a family of products that comprise the world’s smallest fully integrated CMOS single-die flip-chip cellular RF front-ends on the market today.

To date, incumbent vendors have offered costly and bulky RF front end multi-chip modules (MCMs). These complex MCMs typically consist of GaAs HBT PAs, CMOS controller circuitry, SOI switches and various Surface Mount Devices (SMDs). Based on its patented architecture and proprietary techniques and methodologies, Morfis has fully integrated these functions in a low-cost high performance CMOS single die flip-chip device.

“Morfis’ highly experienced and innovative team has achieved a significant breakthrough in RF Front End technology by integrating PAs, switches and control circuitry into an ultra-small CMOS single-die flip-chip,” said Dr. Charlie Chen, Morfis’ Chief Technology Officer. “Our team has achieved this while meeting and exceeding existing GaAs HBT performance in APT mode without the use of Envelope Tracking (ET).”

MORF90x Product Family

The MORF90x is a family of Multi-Mode Multi-Band (MMMB) front end solutions with integrated PAs, switches and MIPI/RFFE control circuitry. The family is optimized for APT mode, is ET ready, and supports the entire cellular frequency range from 698MHz-2690MHz for worldwide 3G/LTE networks.

The MORF90x family is offered in the following form factors:

  • MORF902: 4.0mm x 6.8mm x 0.7mm, 42-pad LGA package (pin-to-pin compatible with existing incumbent products)
  • MORF900: 3.0mm x 5.2mm x0.7mm 36-pad LGA (43% smaller than MORF902)
  • MORF900-FC: Flip-chip die for module manufacturers only

MORF80x Product Family

The MORF80x is a family of Multi-Mode Multi-Band (MMMB) front end solutions with integrated PAs, switches and MIPI/RFFE control circuitry supporting LTE bands 7, 30, 38, 40, 41.

The MORF80x family is offered in the following form factors:

  • MORF802: 4.0mm x 3.65mm x 0.7mm, 28-pad LGA package (pin-to-pin compatible with existing incumbent products)
  • MORF800: 2.5mm x 2.5mm x 0.7mm, 20-pad LGA (57% smaller than MORF802)
  • MORF800-FC: Flip-chip die for module manufacturers only

MORF70x Product Family

The MORF70x is a family of Multi-Mode Multi-Band (MMMB) front end solutions with Quad-band GSM/EDGE, dual-band TD-SCDMA, and TDD LTE MMMB PAs, 14 integrated Transmit/Receive (TRx) switch ports and MIPI control circuitry supporting Quad-band 2G/2.5G and TD-SCDMA/LTE bands 34, 39. The MORF70x family is offered in the following form factors:

  • MORF702: 5.5mm x 5.3mm x 0.7mm, 38-pad LGA package (pin-to-pin compatible with existing incumbent products)
  • MORF700: 4.1mm x 4.1mm x 0.7mm, 36-pad LGA (45% smaller than MORF702)
  • MORF700-FC: Flip-chip die for module manufacturers only

All samples are available today for alpha customers, with mass production scheduled to start in Q2 2016.

For more information, visit www.morfsemi.com.

About Morfis Semiconductor, Inc.

Morfis Semiconductor, based in Irvine, Calif., is a leading fabless developer of fully integrated, single-chip, single-die RF front-end solutions.



Contact:

Morfis Semiconductor
Michael Lee,
VP, Marketing
Main number: 949-656-8890
email: Email Contact




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