InterDigital Showcases Working 5G Solutions Years Ahead of Broad Market Rollout

BARCELONA and WILMINGTON, Del., Feb. 16, 2016 (GLOBE NEWSWIRE) -- MOBILE WORLD CONGRESS -- In order to meet the challenging bandwidth and latency needs of 5G in a world with a multiple of the number of connected devices we see today, InterDigital, Inc. (Nasdaq:IDCC), a mobile technology research and development company, has innovated a number of working 5G access and network solutions that it is featuring at Mobile World Congress, the industry's premier conference, from February 22-25, 2016 in Barcelona. The demos will showcase live working 5G technology solutions more than five years ahead of broad market rollout – the latest chapter in the company's long history of groundbreaking mobile technology development years ahead of the market.

The company's presence at MWC 2016 will showcase a suite of advanced wireless technologies that help to enable more efficient wireless networks, a richer multimedia experience and new mobile broadband capabilities. In terms of product and technology demonstrations:

  • InterDigital will showcase a working 5G access platform, its ultra mobile broadband solution. The platform uses Xilinx FPGAs and Infineon BGT radios to generate a wide bandwidth millimeter wave (mmW) radio access link, which incorporates advanced MIMO, and hybrid analog/digital beamforming technology.
  • The transition to 5G will involve completely new ways of envisioning the architecture of network infrastructure. InterDigital will showcase a unique and innovative Next Generation Networks (NGN) architecture, with a flexible routing solution that reinvents the approach to IP-based services. The live demo uses software-defined networking (SDN) and network function virtualization (NFV) to improve network utilization.
  • High speed and low latency are expected to be cornerstone 5G requirements, particularly for the delivery of virtual reality and augmented reality. InterDigital will highlight its EdgeHaulTM millimeter-wave mesh backhaul technology to deliver a live, functioning virtual reality telepresence use case.
  • InterDigital will demo how to achieve better tracking and utilization of the available bandwidth, leading to better visual quality for the end user through its intelligent streaming solution that combines the state-of-the-art scalable coding standard with DASH-based adaptive streaming.

“InterDigital has a long history of leading the industry, from the first all-digital mobile telephony solutions to some of the first video demonstrations over wireless to one of the first high-performance HSPA chip technologies on the market. Our presence this year at Mobile World Congress, which is punctuated by live, working demos of technologies several years ahead of broad market adoption, once again highlights the strength of our company’s research and contributions to the industry,” said Lawrence F. Shay, Senior Executive Vice President, Future Wireless at InterDigital.

InterDigital will also stream the demos live from the booth on Tuesday, February 23 at 3:30 p.m. CET (9:30 a.m. Eastern). Visit the company's website at for more information and details on how to view the demos.

In addition to demonstrations, InterDigital will be a gold sponsor at an executive luncheon presented by FierceWireless, titled "The Path to 5G: What Operators Need to do to Prepare for the Network of the Future," on Tuesday, February 23, 2016 from 12:30 p.m. to 2:00 p.m. CET at the Fira Congress Hotel in Barcelona.

If you're in Barcelona, please feel free to visit InterDigital's booth in Hall 7 Stand 7A71.

About InterDigital ®

InterDigital develops mobile technologies that are at the core of devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies. Founded in 1972, InterDigital is listed on NASDAQ and is included in the S&P MidCap 400® index.

InterDigital is a registered trademark of InterDigital, Inc.

For more information, visit:

InterDigital Contact:
Patrick Van de Wille
+1 (858) 210-4814

Primary Logo

Review Article Be the first to review this article

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Invitation to Participate in VSDOpen2020
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
The Next Generation of Register, Sequence, and SoC Automation
Colin WallsEmbedded Software
by Colin Walls
Spotting the difference – subtleties of C
Senior Application Engineer Formal Verification for EDA Careers at San Jose and Austin, California
Upcoming Events
SEMICON Taiwan 2020 Goes Hybrid! at United States - Sep 23 - 25, 2020
Robotics Summit & Expo at Hynes convention center Boston MA - Sep 24 - 25, 2020
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers

© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise