Open-Silicon to Participate in Panel Discussion About Multi-Die IC Design and Manufacturing at IEEE EDPS in Monterey

MILPITAS, CA--(Marketwired - April 19, 2016) - Open-Silicon, a system-optimized ASIC solution provider, today announced that Vice President of Manufacturing Operations Asim Salim will be a featured panelist and presenter at the IEEE Electronic Design Process Symposium (EDPS) event in Monterey, CA on April 21.

What: IEEE Electronic Design Process Symposium 2016

Presentation: Multi-Die ASIC SiP (System in Package) Manufacturing

Panel: Multi-Die IC Design and Application

Who: Asim Salim, Vice President of Manufacturing Operations, Open-Silicon

When: Thursday, April 21, 2016

Session 3, 3:45 PM

Where: Monterey Tides Hotel

2600 San Dunes Drive

Monterey, CA 93940

Presentation Abstract: The adoption of 2.5D technology presents a multitude of game-changing advantages for chip designers facing the complexity and cost of smaller geometries. Adding interposer into the design increases the complexity of package design, assembly and testing both at the wafer level and the SiP level. This discussion will focus on challenges and solutions for the 2.5D ASIC SiP manufacturing supply chain ecosystem. The manufacturing supply chain ecosystem for key applications driving 2.5D ASIC SiP will also be discussed.

About EDPS

The Electronic Design Process Symposium has fostered the free exchange of ideas among the top thinkers, movers and shakers who focus on how chips and systems are designed in the electronics industry. It provides a forum for this cross-section of the design community to discuss state-or-the-art improvements to electronics design processes and CAD methodologies, rather than on the functions of the individual tools themselves. To register for the event, please visit the EDPS registration page.

About Open-Silicon

Open-Silicon transforms idea into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system, software, and IP -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 110 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.



Purvi Shenoy
Open-Silicon
408-240-5772

Email contact


Media Contact: Jennifer DeAnda 208-794-7113 Email contact




Review Article Be the first to review this article
Aldec

 Advanced Asembly

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! CEO Outlook May 18
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Automating the UVM Register Abstraction Layer (RAL)
Jobs
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Test and Measurement System Architect for Xilinx at San Jose, California
Electronics Engineer for Lockheed Martin at Sunnyvale, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
SerDes Applications Design Engineer for Xilinx at San Jose, California
Business Operations Planner for Global Foundaries at Santa Clara, California
Upcoming Events
DVCon China 2021 at Shanghai China - May 26, 2021
CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise