FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform – IPU2.0

New solutions will be showcased at CES 2017

SAN JOSE, Calif. — (BUSINESS WIRE) — December 20, 2016Tessera Holding Corporation (Nasdaq: TSRA) (the “Company” or “Tessera”) today announced that its wholly owned subsidiary, FotoNation Limited, and VeriSilicon Holdings Co., Ltd. (“VeriSilicon”), have entered into an agreement to jointly develop a next generation image processing platform that offers best-in-class programmability, power, performance and area for computer vision (CV), computational imaging (CI) and deep learning. The market-ready IP platform, named IPU 2.0, will be available for customer license and design in the first quarter of 2017. IPU 2.0 offers a unified programing environment and pre-integrated imaging features for a wide range of applications across surveillance, automotive, mobile, IoT and more.

FotoNation’s hybrid imaging approach tightly coupled with VeriSilicon’s parallel computation capabilities makes IPU 2.0 the ideal platform to deliver industry proven computer vision, computational imaging and deep learning solutions to the market. IPU 2.0 offers differentiation via open initiatives such as: OpenVX, OpenCL, OpenCV, Caffe and TensorFlow, facilitating seamless, concurrent processing between computer vision, computational imaging and deep neural networking features. The joint technology and IP development agreement combines unique technologies from both companies and brings to market an imaging platform preloaded with a wide range of industry proven real-time parallel-execution imaging features.

According to a recent report by the market intelligence firm, Tractica, the computer vision hardware and software market is estimated to grow from $6.6 billion in 2015 to $48.6 billion by the year 2022.1 Tractica credits automotive, sports and entertainment, consumer, robotics and machine vision, security and surveillance, agriculture, retail and medical markets for growing market demand for high performance, fast and low-power embedded vision solutions.

“With the introduction of IPU2.0, FotoNation and VeriSilicon are raising the bar for computer vision and computational imaging technologies by offering the best combination of programmability, power, performance and area in the market,” said Sumat Mehra, senior vice president and general manager, FotoNation. “We have teamed up with VeriSilicon to help our OEM and ODM customers accelerate the development and delivery of end-to-end integrated computer vision applications and systems with our latest CV, CI and deep learning capabilities. These new solutions fill an important need in the market as OEMs and ODMs integrate computer vision and advanced imaging applications across their product portfolios.”

“VeriSilicon’s proven and scalable vision processor core family has been adopted by world’s leading automotive and surveillance suppliers over the years,” said Weijin Dai, EVP, chief strategy officer and general manager of the IP Division, VeriSilicon. “These highly power efficient, scalable processors with deep learning CNN technology in a unified programing environment unleashes great potential in an increasingly connected world with big data analytics and artificial intelligence. Working closely with FotoNation, we will jointly provide the total solution to address the challenges in intelligent devices.”

For more information, or to get an early preview of the FotoNation and VeriSilicon solutions at CES, please visit the FotoNation suite (Westgate Hotel, North Tower, Floor 23, Suite 121) or the VeriSilicon suite (Westgate Hotel, North Tower, Floor 26, Suite 121).

About Tessera Holding Corporation

Tessera Holding Corporation is the parent company of Tessera, DTS, FotoNation and Invensas. We are one of the world’s leading product and technology licensing companies. Our technologies and intellectual property are deployed in areas such as premium audio, computational imaging, computer vision, mobile computing and communications, memory, data storage, 3D semiconductor interconnect and packaging. We invent smart sight and sound technologies that enhance and help to transform the human connected experience. For more information, call +1 408-321-6000 or visit  www.tesseraholdingcorporation.com.

Tessera, FotoNation, and their respective logos, are trademarks or registered trademarks of affiliated companies of Tessera Holding Corporation in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

About VeriSilicon Holdings Co. Ltd.

VeriSilicon Holdings Co., Ltd. is a Silicon Platform as a Service (SiPaaSTM) company that provides IP-centric, platform based custom silicon solutions and end-to-end semiconductor turnkey services for a wide range of applications across a wide variety of end markets including mobile internet devices, datacenters, the Internet of Things (IoT), wearable electronics, smart homes, and automotive.

VeriSilicon's SiPaaS solutions shorten design cycle, enhance quality, and reduce risk. The breadth and flexibility of our SiPaaS solutions make it an attractive alternative for a variety of customer types, including both emerging and established semiconductor companies, Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and large Internet platform companies.

VeriSilicon's silicon platforms include licensable Vivante GPU cores and vision image processors, ZSP® (digital signal processor) based HD audio, HD voice, multi-band and multi-mode wireless platforms, Hantro HD video platforms, wearable electronics platforms, IoT platforms, mixed signal NUI (natural user interface) platforms for voice, motion and touch interface. VeriSilicon's custom silicon turnkey service encompasses design service that combines its technology solutions and value-added mixed signal IP portfolio targeted for a wide range of process technology nodes, including advanced nodes like 28nm and 22nm FD-SOI, FinFET and provide product engineering service for System on a Chip (SoC) as well as System in a Package (SiP).

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