Molex Showcases Impulse™ Orthogonal Direct Backplane Connector at DesignCon 2017

Scalable 56/112 Gbps solution delivers credible performance and density at a lower applied cost

LISLE, Ill. — (BUSINESS WIRE) — January 31, 2017Molex will debut the Impulse™ Orthogonal Direct Backplane Connector System at the DesignCon 2017 Expo, Booth 619, February 1-2 in Santa Clara, CA. Designed for high-density data center applications, the new Impulse connector system supports data rates of 56 Gbps NRZ and 112 Gbps PAM4 with superior signal integrity.

The 2.00mm column-to-column pitch of the Impulse system delivers high-speed connectivity in a compact size. The innovative signal interface improves insertion loss over traditional in-line interface, pushing resonance beyond 35 GHz.

“Data centers are expected to deliver ever-faster data rates. However, as speeds increase, insertion loss and ICR margin become issues,” said Bratislav Kostic, new product development manager, Molex. “Impulse orthogonal direct connectors offer exceptional signal integrity performance, improved airflow and cost savings by eliminating the need to build and install mid-plane connections.”

The Impulse connector design provides an innovative contact interfaces in which all signal contacts are pre-loaded, positioned and protected in individual slots. Robust guiding features ensure proper connector alignment and mating.

The Molex OD portfolio of backplane connectors includes the Impact™ (sub 25 Gbps) and Impact™ zX2 (28 Gbps), Impel™ (40 Gbps) and Impel™ Plus (56 Gbps), and Impulse (56/112 Gbps). All of these scalable solutions deliver a stable channel impedance and help decrease system-level applied costs by eliminating the chassis mid-plane.

“As data rates climb, data centers need easy scalability in equipment to minimize future infrastructure investments. Impulse orthogonal direct backplane connectors are forward compatible to meet future data rate needs without having to replace infrastructure,” adds Kostic.

For more information about Molex orthogonal direct backplane connectors, please visit

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical. For more information, please visit

Molex Resources:

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.


Outlook Marketing Services
Christa Carroll
Senior Vice President
Email Contact

Review Article Be the first to review this article

Featured Video
Latest Blog Posts
Colin WallsEmbedded Software
by Colin Walls
Selecting a CPU
Sr. Electrical Hardware Project Engineer for Stellartech Research Corp at Milpitas, California
Product Applications Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Principal Engineer, Firmware Engineering for Western Digital at Milpitas, California
Nano-Optics Process Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Mid to Senior Level Electrical Engineer for Gordon Prill, Inc at Santee, California
Team-Lead - Image Production (m/f/d) for Vexcel-Imaging GmbH at Graz, Austria
Upcoming Events
MEMS & Imaging Sensors Summit at World Trade Center Grenoble France - Sep 25 - 27, 2019
2019 Electronic Design Process Symposium at Milpitas CA - Oct 3 - 4, 2019
Embedded Systems Week (ESWEEK) at New York City NY - Oct 13 - 18, 2019

Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise