EL SEGUNDO, Calif. Feb. 2, 2017 -- A new application example describes five tips for successful 3D electromagnetic (EM) simulation of a packaged chip filter using Analyst™ finite-element method simulator within NI AWR Design Environment. This practical guide was developed to help RF/microwave designers ensure accurate results when using Analyst 3D EM to characterize complex structures commonly found in chip, package and board applications where multiple technologies are integrated through a network of interconnects. By applying these straightforward troubleshooting techniques, engineers can easily diagnose their results to ensure that the EM simulation was properly defined.
The "Five Tips for Successful 3D Electromagnetic Simulation" application example can be downloaded at bit.ly/2jDKqb8.
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