Mentor OSAT Alliance Program Streamlines IC High-Density Advanced Packaging Design and Manufacturing

WILSONVILLE, Ore., June 5, 2017 — (PRNewswire) —
  • Proven low-cost, low-risk path to designing HDAP technologies
  • Trusted verification and signoff process for OSAT customers
  • Increased OSAT business efficiency though proven Mentor flow
  • Launches with Amkor as first OSAT Alliance member

Mentor Graphics logo. (PRNewsFoto/Mentor Graphics Corporation) (PRNewsFoto/MENTOR GRAPHICS CORPORATION)

Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs. By launching this program, Mentor will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced Amkor Technology, Inc. as its first OSAT Alliance member.

Through the Mentor OSAT Alliance, members work with Mentor to create certified design kits to help customers speed up IC and advanced package development with Mentor's Tanner® L-Edit AMS design cockpit, Calibre® IC physical verification platform, HyperLynx® SI/PI and HyperLynx full-wave 3D tools, Xpedition® Substrate Integrator and Xpedition Package Designer tools, and Mentor's newly announced Xpedition HDAP flow.

"Mentor's customers are pioneering technologies at the heart of IoT, autonomous driving and next-generation wired and wireless networks," said Joe Sawicki, vice president and general manager of the Design to Silicon Division at Mentor. "Many of these companies are designing ICs that use advanced packaging from OSATs to achieve their design goals. Like the Mentor Foundry Alliance program did for accelerating foundry design kit creation, the Mentor OSAT Alliance program will help our mutual customers use Mentor's world-class EDA portfolio to more easily implement ICs with advanced packaging technologies."

Members of the Mentor OSAT Alliance will receive software, training, and reference flow best practices from Mentor, in addition to the opportunity for co-marketing mutual offerings.

"The next generation of IC packaging will require increased heterogeneous die integration, incorporating reduced size, weight, and improved performance and reliability," said Ron Huemoeller, corporate vice president, research and development at Amkor. "Amkor's Silicon Wafer Integrated Fan-out Technology (SWIFT™) package technology is designed to provide increased I/O and circuit density within a significantly reduced footprint and profile for single and multi-die applications. Being an integral part of the Mentor OSAT Alliance program will allow us to fast-track PDK development and delivery, and enable our customers to design more efficiently and predictably."

With alliance programs for both foundries and OSATs, Mentor continues to enable the semiconductor ecosystem. The OSAT Alliance program will drive global design and supply chain adoption of these emerging advanced packaging technologies.

Contact
Mike Santarini
Phone: 510-354-7322   E-mail: Email Contact

Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world's most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: http://www.mentor.com.

Mentor Graphics, Mentor, Tanner, Calibre, HyperLynx, Xpedition are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owner.

 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/mentor-osat-alliance-program-streamlines-ic-high-density-advanced-packaging-design-and-manufacturing-300468250.html

SOURCE Mentor

Contact:
Mentor
Amkor Technology, Inc.
Web: http://www.mentor.com/




Review Article Be the first to review this article
Aldec

 True Circuits: Ultra PLL

Featured Video
Latest Blog Posts
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Automation of the UVM Register Abstraction Layer
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Virtual 2020 CEO Outlook Set for June 17
Colin WallsEmbedded Software
by Colin Walls
Multiple constructors in C++
Jobs
Senior Analog Design Engineers #5337 for EDA Careers at EAST COAST, California
Senior Layout Engineer for EDA Careers at EAST COAST, California
Senior Application Engineer Formal Verification for EDA Careers at San Jose and Austin, California
Software Engineer for EDA Careers at RTP, North Carolina
Upcoming Events
Sensors Expo & Conference at McEnery Convention Center 150 W. San Carlos Street SAN JOSE CA - Jun 22 - 24, 2020
Nanotech 2020 Conference and Expo at National Harbor MD - Jun 29 - 1, 2020
IEEE Computer Society Annual Symposium on VLSI (ISVLSI) 2020 at Limassol Hotel, Amathus Area, Pareklisia Cyprus - Jul 6 - 8, 2020
57th Design Automation Conference 2020 at San Francisco CA - Jul 19 - 23, 2020



© 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise