Open-Silicon to demonstrate its Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ and present a technical paper at TSMC OIP 2017 in Santa Clara

September 12, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at TSMC Open Innovation Platform® (OIP) 2017 in Santa Clara. The company will demonstrate its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+. Additionally, Open-Silicon will be presenting a technical paper titled, "High Bandwidth Memory (HBM2) IP Subsystem Silicon Validation and Interoperability with HBM2 Memory Die Stack."

Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+

This solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). Open-Silicon's IP fully complies with the HBM2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die I/O needed to drive the interface between the logic-die and the memory die-stack on the 2.5D interposer. 

http://www.open-silicon.com/high-bandwidth-memory-ip

Exhibit

When: September 13, 2017
Where: Booth # 708 on the Exhibition Floor,
Santa Clara Convention Center,
5001 Great America Pkwy,
Santa Clara, CA 95054

Paper Presentation Topic: "High Bandwidth Memory (HBM2) IP Subsystem Silicon Validation and Interoperability with HBM2 Memory Die Stack" 
When: September 13, 2017
Where: IP/EDA/Services Track, 13:00 - 13:30

Stop by the Open-Silicon booth # 708 on the exhibition floor to see the 2.5D HBM2 ASIC SiP demo and learn how we can help you realize your design ideas using HMB2 IP and other cutting edge ASIC / SoC technologies.

About Open-Silicon

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software and IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 130 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.

To learn more visit: www.open-silicon.com




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