14nm FinFET 2.5D/HBM2/SerDes Webinar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logic

SAN JOSE, CA--(Marketwired - January 10, 2018) - Samsung Electronics, ASE Group, eSilicon, Rambus and Northwest Logic have joined forces to offer a complete FinFET-based high-bandwidth memory (HBM) supply chain solution. HBM2 is a JEDEC-defined standard that utilizes 2.5D technology to interconnect an SoC with an HBM memory stack. HBM2 is being used in very high-bandwidth applications. This webinar will present a complete FinFET-based supply chain that leverages advanced IP and 2.5D technology to deliver customer designs now.

"FinFET ASICs for Networking, Data Center, AI and 5G Using 14nm, 2.5D, HBM2 and SerDes"
January 17, 2018
8:00-9:00 AM and
6:00-7:00 PM
Pacific Standard Time

Agenda
Samsung: HBM2 memory solution
Samsung: Foundry solutions including 14nm FinFET technology
ASE Group: advanced 2.5D packaging
eSilicon: ASIC and 2.5D design and implementation, HBM2 PHY, high-speed memories
Rambus: high-performance SerDes
Northwest Logic: HBM2 controller

Details
Register for 8 AM webinar
Register for 6 PM webinar

About ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry's ever-growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc. and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com or twitter @asegroup_global.

About eSilicon
eSilicon is an independent provider of complex FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete, 2.5D/HBM2 and TCAM platforms for FinFET technology at 14/16/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.

About Rambus
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.

About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express Solution (PCI Express 4.0/3.0/2.1/1.1 cores, DMA cores and drivers), Memory Interface Solution (HBM2, DDR4/3, LPDDR4/3, MRAM), and MIPI Solution (CSI-2, DSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs.

eSilicon is a registered trademark, and the eSilicon logo is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners.




Contacts:
Sally Slemons
eSilicon Corporation
408-635-6409

Email contact


Susan Cain Cain Communications 408-393-4794 Email contact




Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
ESD Alliance/Accellera Panel Takes Executive View on Returning to the Office
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Arteris IP Extends IP-XACT to UVM Testbenches
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Specification Automation for Designers
Jobs
Design Verification Engineer II for Synopsys, Inc. at Mountain View, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California
Business Operations Planner for Global Foundaries at Santa Clara, California
Logic Design Engineer for Intel at Santa Clara, California
Upcoming Events
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
SEMI Europe Summit at Online, Central European Time Germany Germany - Sep 1 - 3, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise