Handles homogeneous and heterogeneous chip integration with high-density packaging to enhance the efficiency of chip and passive design optimization
KAOHSIUNG, Taiwan & SAN JOSE, Calif. — (BUSINESS WIRE) — January 31, 2018 — Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311, NYSE: ASX), and Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. The solution consists of the SiP-id™ (System-in-Package - intelligent design) design kit, an enhanced reference flow including IC packaging and verification tools from Cadence, and a new methodology that aggregates the requirements of wafer-, package- and system-level design into a unified and automated flow. By deploying the SiP-id™ methodology, designers can reduce design iterations and greatly improve throughput as compared to existing advanced packaging EDA tools, reducing the time needed to design and verify ultra-complex SiP packages.
In today’s smart world, innovators are on the front line, designing devices that pack greater functionality, generate higher and faster performance, and consume lower power, all while being integrated within shrinking space parameters. As a result, the role of IC packaging in electronics has never been more important than now. Technology has become an integral part of daily life, with global proliferation of smartphones and wearables, and significant application strides in artificial intelligence, autonomous vehicles and the internet of things (IoT). These developments have created immense opportunity for ASE to apply its SiP technology beyond package level to module-, board- and system-level integration.
Previously, IC packaging engineers leveraged standard EDA design tools coupled with a set of loosely defined rules to lay out their packages. However, this approach has many limitations when designing today’s advanced multi-die packages. To provide a more holistic approach to the design and verification of SiP and advanced fan- out packages, ASE and Cadence collaborated closely to develop a design kit, methodology, and streamlined and automated reference flow using enhanced Cadence® IC packaging and verification tools, all tailored for ASE’s advanced IC package technologies. In a typical use case with high-pin-count dies, packaging engineers using SiP-id™ and the accompanying reference flow and methodology were able to reduce time from more than six hours to only 17 minutes, compared to existing tools with manual operation.
“As the leader in System-in-Package technology, ASE has been augmenting our design and manufacturing services by building a SiP ecosystem with partners across the entire supply chain including EDA providers,” said C. P. Hung, vice president, Corporate R&D, ASE Group. “SiP-id™ is a prime example of the successful collaboration between ASE and Cadence that achieved optimal results through the mutual sharing of technology and experiences. Ultimately, we aim to offer our customers a set of efficient EDA tools to design more complex chips using ASE’s advanced package and system-level technologies and help them speed up time to market,” he added.
“More and more of our customers are looking at multi-die advanced-package technologies to solve their next- generation design challenges,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “Advanced packaging extends Moore’s Law and plays directly into our System Design Enablement strategy, so collaborating with ASE to fulfill their vision for SiP is a natural fit for us. We expect the results of this effort to mutually benefit Cadence and ASE customers by providing a methodology optimized for SiP design.”
SiP-id™ is immediately available from ASE. For enquiries, please email email@example.com or visit http://www.aseglobal.com/en/Technology/AdvancedTechnology.asp for more information.
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.
About The ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever-growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com or twitter @asegroup_global.
Safe Harbor Notice
This press release contains “forward-looking statements” within the
meaning of Section 27A of the United States Securities Act of 1933, as
amended, and Section 21E of the United States Securities Exchange Act of
1934, as amended. Although these forward-looking statements, which may
include statements regarding our future results of operations, financial
condition or business prospects, are based on our own information and
information from other sources we believe to be reliable, you should not
place undue reliance on these forward-looking statements, which apply
only as of the date of this press release. The words “anticipate,”
“believe,” “estimate,” “expect,” “intend,” “plan” and similar
expressions, as they relate to us, are intended to identify these
forward-looking statements in this press release. Our actual results of
operations, financial condition or business prospects may differ
materially from those expressed or implied in these forward-looking
statements for a variety of reasons, including risks associated with
cyclicality and market conditions in the semiconductor or electronic
industry; changes in our regulatory environment, including our ability
to comply with new or stricter environmental regulations and to resolve
environmental liabilities; demand for the outsourced semiconductor
packaging, testing and electronic manufacturing services we offer and
for such outsourced services generally; the highly competitive
semiconductor or manufacturing industry we are involved in; our ability
to introduce new technologies in order to remain competitive;
international business activities; our business strategy; our future
expansion plans and capital expenditures; the uncertainties as to
whether we can complete the share exchange contemplated by a joint share
exchange agreement between Siliconware Precision Industries Co., Ltd.
and us; the strained relationship between the Republic of China and the
People’s Republic of China; general economic and political conditions;
the recent global economic crisis; possible disruptions in commercial
activities caused by natural or human-induced disasters; fluctuations in
foreign currency exchange rates; and other factors. For a discussion of
these risks and other factors, please see the documents we file from
time to time with the Securities and Exchange Commission, including our
2016 Annual Report on Form 20-F filed on April 21, 2017.