A Symposium for High-Performance Chips - August 2018 - Silicon Valley

HOT CHIPS 30 - 2018
CALL FOR PRESENTATIONS

A Symposium on High-Performance Chips

Hot Chips30 2018:
Location TBD: Silicon Valley
Date TBD: August 2018

Hot Chips29 2017 In the News

AUTHORS' SCHEDULE for submissions to Hot Chips 30

Deadline for submissions: March 23, 2018
Notification of acceptance: May 1, 2018
Deadline for final version: July 16, 2018
Deadline for poster submissions: July 3, 2018

AREAS OF INTEREST:

* General Purpose Processor Chips
   - High-Performance and Low-Power
   - Multi-Core and Highly-Reliable Systems
* Mobile and Embedded Devices
   - Graphics/Multimedia/Game
   - SoC, Security, and DSP Chips
* Communications and Networking
   - Wireless LAN/WAN/PAN
   - Network and IO Processors
* Emerging Computation Architectures
   - Machine Learning, Vision and 
Graphics/Compute Engines
   - Data Analytics and Big Data processing
   - IoT and Always-On Functions 
   - Neuromorphic and Quantum Computing
* Other Chips
   - FPGAs and FPGA-Based Systems
   - Custom Chips for Emerging Applications
   - Open -Source Chips
* Other Technologies
   - Power and Thermal Management
   - Packaging and TEsting
   - Display Technologies
   - On -Chip Optics & Sensors
   - Novel Computing Technologies
* Memory Technologies
   - Persistent Memory, Phase Change
   - Packaging, 3D, Stacked
* Software for Multi -Core, Heterogeneous Systems
   - Programming models, Runtime Systems
   - Performance, Power, Debug and Evaluation

AUTHOR INFORMATION AND FORMAT

Presentations at HOT CHIPS are in the form of 30-minute talks in PowerPoint or .PDF. Presentation slides will be published in the HOT CHIPS Proceedings.

Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro. Poster submissions are also accepted from both industry and academia, and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive a Best Student Poster Award.

Submissions must specify "Presentation", "Poster" or "Student Poster". Regular Presentations consist of a title, extended abstract (two pages maximum) and the presenter's contact information (name, affiliation, job title, address, phone(s), fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping

submission to another conference or journal. Also indicate if you would like the submission to be held confidential. If so indicated, these submissions remain confidential until the first day of the conference. Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, indicate its status - design, development, tape out, silicon, shipping, etc.

To submit, go to www.hotchips.org Authors will be notified of acceptance decisions by May 1, 2018.
Send questions relating to the program to the program chairs Stefan Rusu and John Kobiatowicz at: program@hotchips.org
and questions relating to conference operation to the general chair, David Lau, at: info@hotchips.org
Sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Computer Society, technically co-sponsored by the Solid State Circuits Society and In Cooperation with the Association of Computing Machinery, SIGARCH.
Check the HOT CHIPS 30 web page for updates: http://www.hotchips.org

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