Smart Manufacturing, Big Data to Highlight ASMC 2018

MILPITAS, Calif.  — March 5, 2018 — SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2018) will bring together more than 100 industry experts and feature 35 hours of technical presentations spanning all aspects of semiconductor manufacturing. April 30 – May 3 in Saratoga Springs, New York, ASMC 2018 gathers semiconductor professionals for the latest information on practical applications of advanced manufacturing strategies and methodologies. Registration is now open.

The leading international technical conference for micro-electronics manufacturing innovation, ASMC 2018 features a panel discussion on “Industry 4.0 and the Future of Commercial Semiconductor Device Manufacturing,” a tutorial on “Big Data Analytics and the Smart Factory in Microelectronics Manufacturing” by Prof. James Moyne, University of Michigan, and the event’s popular interactive poster session.

Back by popular demand, the  Women in Semiconductors program will highlight the importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Held April 30 in conjunction with ASMC 2018, the program is sponsored by  Applied MaterialsIBM, and  Thermo Fisher Scientific. Registration is complimentary for ASMC attendees.  

ASMC 2018 keynotes will be delivered by:

  • Mukesh V. Khare, Ph.D.,  IBM Research
  • Anda Mocuta, Ph.D.,  imec
  • Robert Maire,  Semiconductor Advisors

ASMC 2018 technical sessions include:

Advanced Process Improvement

  • Advanced Materials and Photonics
  • Advanced Patterning/Design for Manufacturability
  • Advanced Process Control
  • Contamination Free Manufacturing
  • Yield Management
  • Advanced Metrology
  • Defect Inspection
  • Factory Optimization

The conference is co-chaired by Prof. Agnès Roussy,  Ecole des Mines de Saint-Etienne, and Raymond Van Roijen,  GLOBALFOUNDRIES

Technical sponsors include:  Institute of Electrical & Electronics Engineers (IEEE)IEEE Electron Devices Society (EDS), and IEEE Electrons Packaging Society (EPS).

Corporate sponsors include:  Applied Materials, Applied Seals N.A., BisTEL, Edwards, Elemental Scientific, GreeneTweed, IBM, Inficon, KLA-Tencor, Levitronix, M+W Group, Siconnex, Thermo Fisher Scientific, Valqua America.

For conference details contact Margaret Kindling at  Email Contact or phone 1.202.393.5552. Qualified members of the media should contact Michael Hall (SEMI Public Relations) at Email Contact for media registration information. 

About SEMI

SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit  www.semi.org 



Contact:

Michael Hall/SEMI
1.408.943.7988
Email Contact




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