Media Alert: Open-Silicon to Present at TSMC OIP Theater at DAC 2018

MILPITAS, Calif., June 21, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, will present on three topics at the TSMC Open Innovation Platform® (OIP) Theater at DAC 2018 in San Francisco. The presentations will address how increases in cores, bandwidth and data in deep learning and networking applications are driving the need for custom processors and ASIC SiPs with High Bandwidth Memory (HBM2). They will also provide an overview of the critical IP building blocks required for 2.5D HBM2 ASIC SiP design and manufacturing solutions. All presentations will take place at the TSMC OIP Theater in Booth 1629.  

  1. Who: Asim Salim, VP of Manufacturing Operations, Open-Silicon

    What: Turnkey 2.5D HBM2 ASIC SiP Solution for Deep Learning and Networking Applications

    This presentation will address the growing memory requirements for deep learning and networking applications, and how a silicon-proven HBM2 IP subsystem in TSMC’s FinFET and CoWoS® technologies is enabling these applications and successful ramping of 2.5D HBM2 ASIC SiP designs into volume production. 

    When: Monday, June 25, 2:15 – 2:30 p.m.

  1. Who: Kalpesh Sanghvi, Technical Manager for IP and Platforms, Open-Silicon

    What: IP Subsystem Solutions for Deep Learning and Networking Applications

    This presentation will address the key building blocks of deep learning and networking applications, including an HBM2 IP subsystem, a networking IP subsystem and a multi core processor IP subsystem including RISC-V targeted for TSMC’s advanced process technologies.

    When: Tuesday, June 26, 11:30 – 11:45 a.m.

  1. Who: Abu Eghan, Sr. Manager of Packaging & Assembly Operations, Open-Silicon

    What: Package Design, Assembly and Test Strategies for robust 2.5D HBM2 ASIC SiP Manufacturing

    This presentation will address solutions and strategies for mitigating the interposer design, package design, assembly and test challenges associated with 2.5D HBM2 ASIC SiP manufacturing in TSMC’s FinFET and CoWoS® technologies.

    When: Wednesday, June 27, 3:30 – 3:45 p.m.

About Open-Silicon

Open-Silicon is a system-optimized ASIC solution provider that innovates at every stage of design to deliver fully tested IP, silicon and platforms. To learn more, visit www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.

Contact Information:
Purvi Shenoy
Open-Silicon
408-240-5772
Email Contact

Media Contact:
Jennifer DeAnda
208-794-7113
Email Contact

 

Primary Logo




Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Trends in the Semiconductor Design Ecosystem
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Arteris IP Extends IP-XACT to UVM Testbenches
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Specification Automation for Designers
Jobs
Test and Measurement System Architect for Xilinx at San Jose, California
Business Operations Planner for Global Foundaries at Santa Clara, California
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
SerDes Applications Design Engineer for Xilinx at San Jose, California
Upcoming Events
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
SEMI Europe Summit at Online, Central European Time Germany Germany - Sep 1 - 3, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise