Toshiba Announces New Analog Output IC Photocoupler for Automotive Applications

- New device delivers high-speed communications capability to the automotive environment

TOKYO — (BUSINESS WIRE) — July 4, 2018Toshiba Electronic Devices & Storage Corporation (“Toshiba”) announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20180704005392/en/

Toshiba: A new analog output IC photocoupler "TLX9309" that enables high-speed communications in aut ...

Toshiba: A new analog output IC photocoupler "TLX9309" that enables high-speed communications in automotive applications. (Photo: Business Wire)

The new TLX9309 consists of a high-output GaAlAs light emitting diode (LED) that is optically coupled to a high-speed detector. The detector consists of a photodiode and a transistor integrated onto a single chip. A Faraday shield has been integrated onto the photodetector chip to provide enhanced levels of common-mode transient immunity – typically up to 15kV/μs, an important parameter in electrically noisy automotive environments.

By separating the photodiode and amplification transistor, the collector capacitance is reduced, reducing propagation delays and making the open-collector TLX9309 faster than transistor output devices. In fact, propagation delay times are guaranteed to be between 0.1μs and 1.0μs, with the difference between high to low and low to high transition (|tpLH-tpHL|) being no more than 0.7μs, making the device suitable for high-speed communications such as inverter control or as an interface to intelligent power modules (IPM).

Electrically, the device offers 3750Vrms of isolation with 5.0mm of creepage and clearance for safety isolation. It operates from a supply in the range -0.5 to 30V DC and can drive up to 25mA at output voltages up to 20V. The current transfer ratio is in the range 15-300%.

The TLX9309 is packaged in a 3.7mm x 7.0mm x 2.2mm RoHS compliant 5-pin SO6 package and operates over the temperature range -40°C to +125°C. The device is AEC-Q101 qualified for use in automotive applications.

The TLX9309 is now in mass production.

Applications

Automotive equipment

  • I/O signal communications in inverter control circuits
  • Signal communications within equipment

Features

  • Analog output (Open collector)
  • Data communication rate: 1 Mbps (typ.) @NRZ
  • Compared with a transistor output, propagation delay time is faster:
    tPHL=0.8 μs (max), tPLH=1.0 μs (max)
  • AEC-Q101 qualified
 

Main Specifications

 (@Ta=25°C)

Part number   TLX9309
Absolute

maximum

ratings

  Forward current IF (mA) 15
Output current I O (mA) 25
Supply voltage V CC (V) -0.5 to 30
Output voltage V O (V) -0.5 to 20
Electrical

characteristics

Low level output voltage V OL max (V) 0.4
Current transfer ratio I O /I F min/max (%) 15 / 300
High level supply current I CCH max (μA) 1
Switching

characteristics

Data communications rate typ. (Mbps) 1

Propagation delay time (H to L) t pHL max (μs)

0.8

Propagation delay time (L to H) t pLH max (μs)

1.0
Propagation delay difference |t pLH -t pHL | max (ns) 0.7
Isolation characteristics Isolation voltage BV S min (Vrms) 3750
Clearance distances min (mm) 5.0
Creepage distances min (mm) 5.0
Package Name 5pin SO6
  Size typ. (mm)   3.7×7.0×2.2
 

1 | 2  Next Page »



Review Article Be the first to review this article
 Advanced Asembly

Featured Video
Editorial
More Editorial  
Latest Blog Posts
Colin WallsEmbedded Software
by Colin Walls
Variable declarations in C – plenty of pitfalls
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
AUGER: Celebrating Our Users
2021 EDACafe PredictionsEDACafe Editorial
by 2021 EDACafe Predictions
Atmosic Technologies Electronics Design Industry Predictions
Jobs
ASIC Engineer for Amazon at seattle, Washington
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California
Upcoming Events
DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021
IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021
ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021
ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise