Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications

COLLEGE STATION, TX – 01 August 2018 — Vidatronic, Inc., a leading developer of CMOS power management and radio frequency (RF) power intellectual property (IP) cores, today announced a collaboration with RF system-on-a-chip (SoC) design company, Nurlink Technology, to develop an unprecedented SoC solution built to power wireless communication systems for the Internet of Things (IoT). The SoC will combine Vidatronic’s patented power management unit (PMU) IP technology with Nurlink’s advanced RF technology to create a solution that will advance the impact of IoT advancements in applications such as connected cars, smart homes, Artificial Intelligence (AI), robotics, and more.

Chengzhou Wang, CTO of Nurlink, stated: “It is our great pleasure to announce this partnership with Vidatronic. Their impressive IP portfolio and expertise in power management in advanced process nodes makes them the obvious partner to ensure our chip provides high-levels of performance while still maintaining superior power savings.”

“We are delighted to announce Nurlink as a partner and licensee of our PMU IP,” said Stephen Nolan, Vice President of Sales and Business Development at Vidatronic. “Nurlink is composed of an impressive team of wireless communication experts, and the next generation devices they are developing will rapidly accelerate the IoT market.”

Vidatronic’s PMU combines several of the company’s patented power management solutions into a single IP core that can be integrated alongside RF solutions in a wide array of consumer and IoT devices, including smartphones, tablets, and other wearables. For more information on licensing Vidatronic’s PMU IP cores, contact our sales team at  Email Contact.

About Vidatronic, Inc.

Vidatronic, founded in 2010, helps customers by licensing our latest CMOS power management and radio frequency (RF) power intellectual property (IP) cores for integration into their application specific integrated circuits (ASICs) and systems on a chip (SoCs). Our capabilities help customers achieve product feature and performance advantages. Our service gets them to market faster and our experience reduces overall risk. We have patented industry-leading technologies and features that allow our customers to reduce required board area and cost, while maintaining the desired low-noise and low quiescent-current performance in a variety of applications, from consumer electronics to servers. Our IP portfolio includes low dropout (LDO) voltage regulators, DC-DC converters, ultra-low-power voltage references, CMOS RF power amplifiers, and associated circuitry. For more information visit  http://www.vidatronic.com.

About Nurlink

Nurlink Technology, founded in 2017, is a fabless IC design company with subsidiaries and offices in California, Shenzhen, Beijing, Nanjing, and Hong Kong. Leveraging its world-class talents in RF analog, 5G Modem, GNSS, and SoC systems and software, Nurlink Technology commits to creating the best RF/SoC chips for powering the next-generation 5G wireless communications while enabling significant cost and performance advantages for customers. The current product portfolio from Nurlink Technology includes NB-IoT and cat-M SoCs, serving numerous markets including smart meter, smart city, wearables, asset tracking, and more. For more information visit  http://www.nurlink.com.




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