SAN JOSE, Calif. — (BUSINESS WIRE) — November 13, 2018 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the complete Cadence® advanced packaging design and analysis tool flow is certified by Samsung Foundry for Fan-Out Panel-Level-Packaging (FO-PLP) and silicon-interposer 2.5D packaging. This proven on-/off-chip design flow is in use now by multiple customers with challenging advanced packaging requirements.
For more information on the Cadence advanced packaging reference flow, visit www.cadence.com/go/samsungpkg.
Insuring sufficient, efficient and stable power delivery, as well as signal integrity, is a significant challenge for customers implementing advanced packages. With the advanced package reference flow, joint customers of Cadence and Samsung now have a documented step-by-step approach to validate these critical electrical requirements to enable first-pass success.
The complete Cadence advanced packaging flow is certified and correlated to the Samsung golden flow using Cadence on-/-off-chip power integrity and signal integrity tools, including Allegro® Sigrity™ PowerSI® technology, Sigrity Broadband SPICE, Sigrity PowerSI 3D-EM Extraction Option, Sigrity SystemSI™ technology, Sigrity System Explorer, Voltus™ IC Power Integrity Solution, Spectre® Accelerated Parallel Simulator and Spectre CPU Accelerator Option. This flow was verified with memory interfaces, high-speed interfaces and a core Power Delivery Network for CPU and GPU through both FO-PLP and Silicon-interposer 2.5D package-based test cases.
“In close collaboration with Samsung, we have delivered a certified, integrated design and analysis flow for the Samsung Foundry advanced package design methodology,” said Steve Durrill, senior product engineering group director at Cadence. “The Samsung certification of our solution that spans our Virtuoso, Allegro and Sigrity product lines enables our joint customers to take advantage of a reference flow that will help reduce cost and improve performance and reliability of their products using advanced packaging techniques.”
"We are pleased to see that the results from the Cadence analysis tools correlate with measurement results,” stated Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. "This collaboration will help our customers with a trusted system design enablement solution for the advanced packages to implement state-of-the-art products."
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
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