Milpitas, Dec. 03, 2018 (GLOBE NEWSWIRE) -- SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.
The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 95 global equipment companies that provide data on a monthly basis.
The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are shown in the attached chart.
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About SEMISEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit
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