Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-Screen Display Smartphones

The 0.8μm-pixel ISOCELL Slim 3T2 brings high-resolution images with the smallest form factor in the industry at 1/3.4 inches

SEOUL, South Korea — (BUSINESS WIRE) — January 21, 2019 — Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. While being the industry’s most compact image sensor at 1/3.4 inches (approximately 5.1-millimeters diagonally), the 0.8μm-pixel ISOCELL Slim 3T2 delivers 20-megapixel (Mp) resolution for both front and back cameras in today’s sleekest mid-range smartphones.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190121005053/en/

Samsung’s new ISOCELL Slim 3T2 image sensor. (Graphic: Business Wire)

Samsung’s new ISOCELL Slim 3T2 image sensor. (Graphic: Business Wire)

“The ISOCELL Slim 3T2 is our smallest and most versatile 20Mp image sensor that helps mobile device manufacturers bring differentiated consumer value not only in camera performance but also in features including hardware design,” said Jinhyun Kwon, vice president of System LSI sensor marketing at Samsung Electronics. “As the demand for advanced imaging capabilities in mobile devices continue to grow, we will keep pushing the limits in image sensor technologies for richer user experiences.”

With 20-million active 0.8μm-sized pixels, the ISOCELL Slim 3T2 not just provides excellent clarity and detail. It also offers high color fidelity by adopting Samsung’s ISOCELL Plus technology that enables sensors to capture and absorb more light information for accurate color reproduction even with sub-micrometer-sized pixels.

In order to support smartphones with the latest display features such as the ‘hole-in display’ or ‘notch design,’ front-facing image sensors need to minimize their size while being able to capture high-quality images. The 1/3.4-inch 3T2 snuggly fits into a tiny module making more space for the display. In addition, Samsung’s Tetracell technology, which merges four pixels to work as one, lets the 3T2 take brighter and sharper pictures in low-light settings as the color filter array’s light sensitivity increases to that of a 1.6μm-pixel image sensor at 5Mp resolution.

When applied in rear-facing multi-camera settings for telephoto solutions, the 3T2 adopts an RGB color filter array instead of Tetracell technology. The small size of the image sensor also reduces the height of the tele-camera module by around seven percent when compared to Samsung’s 1/3-inch 20Mp image sensor, allowing more elegant smartphone designs. Compared to a 13Mp sensor with the same module height, the 20Mp 3T2 retains 60-percent higher effective resolution at 10x digital zoom that presents clearer and more accurate results.

The Samsung ISOCELL Slim 3T2 is expected to be in mass production in the first quarter of this year.

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.



Contact:

Lisa Warren-Plungy
Samsung Semiconductor, Inc.
408 544 5377
Email Contact




Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Trends in the Semiconductor Design Ecosystem
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Arteris IP Extends IP-XACT to UVM Testbenches
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Specification Automation for Designers
Jobs
Logic Design Engineer for Intel at Santa Clara, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Test and Measurement System Architect for Xilinx at San Jose, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Upcoming Events
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
SEMI Europe Summit at Online, Central European Time Germany Germany - Sep 1 - 3, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise