Toshiba Memory Corporation Launches e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASHTM 3D Flash Memory

TOKYO — (BUSINESS WIRE) — February 26, 2019Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1[1] compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190226006346/en/

Toshiba Memory Corporation: e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS F ...

Toshiba Memory Corporation: e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASH(TM) 3D Flash Memory (Photo: Business Wire)

e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.

The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.

Key Specifications

Interface   JEDEC e-MMC Ver. 5.1 standard
HS-MMC interface
Density 16GB, 32GB, 64GB, 128GB[2]
Power Supply Voltage

2.7 to 3.6V (Memory core)
1.7V to 1.95V (Interface)

Bus Width ×1 / ×4 / ×8
Temperature Range -25℃ to +85℃
Package   153Ball FBGA
11.5mm × 13.0mm
 

Line-up of the New Products

Product Name   Capacity   Package   Mass Production
THGAMRG7T13BAIL 16GB 11.5×13.0×0.8mm 3Q, 2019 (Jul.-Sep.)
THGAMRG8T13BAIL 32GB 11.5×13.0×0.8mm
THGAMRG9T23BAIL 64GB 11.5×13.0×0.8mm
THGAMRT0T43BAIR   128GB   11.5×13.0×1.0mm  
 

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