TOKYO — (BUSINESS WIRE) — February 26, 2019 — Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1 compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.
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Toshiba Memory Corporation: e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASH(TM) 3D Flash Memory (Photo: Business Wire)
e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.
The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.
JEDEC e-MMC Ver. 5.1 standard
|Density||16GB, 32GB, 64GB, 128GB|
|Power Supply Voltage||
2.7 to 3.6V (Memory core)
|Bus Width||×1 / ×4 / ×8|
|Temperature Range||-25℃ to +85℃|
11.5mm × 13.0mm
Line-up of the New Products
|Product Name||Capacity||Package||Mass Production|
|THGAMRG7T13BAIL||16GB||11.5×13.0×0.8mm||3Q, 2019 (Jul.-Sep.)|