World’s Smallest* Point-Of-Load DC-DC Converter

  • New series of µPOL™ power solutions, ushers in ‘a new era of power management solutions’ with increased performance, smallest available size, ease of use and simplified integration
  • Scalable and highly configurable with multi-time programmable memory, offering a wide range of flexibility
  • Suitable for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise
  • World premiere at APEC 2019 in Anaheim, CA, March 18 to 20 at the TDK booth 811

SAN JOSE, Calif. — (BUSINESS WIRE) — March 18, 2019 — TDK Corporation (TSE:6762) announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise.

Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source. At 3.3 x 3.3 x 1.5 mm, they minimize the required external components, retaining the highest possible performance while offering a simplified design for ease of integration. This family can deliver a high density solution of 1 watt per mm3, while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.

TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL™ were developed by TDK’s group company Faraday Semi. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

μPOL™ technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs and others. By minimizing the distance between the converter and the chipset, the resistance and the inductance components are minimized, allowing fast response and accurate regulation with dynamic load currents.

The product family is rated for industrial application, is lead free and has ROHS compliance.

TDK will be showcasing its µPOL™ technology at APEC 2019 from March 18 to 20 at the Anaheim Convention Center in Anaheim, CA at booth 811.

* As of March 2019, according to TDK research

Glossary

  • μPOL™ and nPOL™ are integrated DC-DC converters placed in the vicinity of complex ICs such as ASICs, FPGAs, and others.

Main applications

  • Network Storage: Enterprise SSD / Storage Area Network
  • Servers: Main Stream Server, Rack and Blade Server, Micro Server
  • Netcoms and Telecoms: Ethernet Switch and Router and 5G Small Cells and 5G Base Stations
  • Automotive (Future)

Main features and benefits

  • Footprint of 3.3 x 3.3 x 1.5 mm
  • Output of 1 watt per mm3, with 50% less required capacitance than existing products
  • Suitable for a junction temperature range from -40°C to 125°C

μPOL™, nPOL™ and The Future of Integrated Technology™ are registered trademarks of Faraday Semi.

Key data

                 
Type       Dimensions [mm]       Rated current [A]
FS1406       3.3 x 3.3 x 1.5       6
FS1404       3.3 x 3.3 x 1.5       4
FS1403       3.3 x 3.3 x 1.5       3
           

1 | 2  Next Page »



Review Article Be the first to review this article
Aldec


Latest Blog Posts
Michelle Mata-ReyesAldec Design and Verification
by Michelle Mata-Reyes
ARM-based SoC Co-Emulation using Zynq Boards
Jobs
Senior Account Managers… FORMAL VERIFICATION...VALLEY for EDA Careers at San Jose, California
Senior Software Architect Internet for EDA Careers at San Jose, California
Salesforce Technical Lead   East Coast  for EDA Careers at Cherry Hill, New Jersey
Sr. Application Engineer for Mentor Graphics at Fremont, California
Hardware Engineer, Board Design for Arista Networks at Santa Clara, California
Upcoming Events
DVCon U.S. 2020 at DoubleTree Hotel San Jose CA - Mar 2 - 5, 2020
OFC 2020 - The Optical Networking and Communication Conference & Exhibition at San Diego Convention Center San Diego CA - Mar 8 - 12, 2020
DATE '2020 at ALPEXPO Grenoble France - Mar 9 - 13, 2020
NVIDIA’s GPU Technology Conference (GTC) at San Jose McEnery Convention Center 150 West San Carlos Street San Jose CA - Mar 22 - 26, 2020



© 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise