NewLogic Launches WiLD-Mobile IP Enabling Low Cost WLAN Integration into Mobile Products

NewLogic Announces its WiLD(TM)-Mobile Wireless LAN IP Solution Optimized for the Power and Size Requirements of the Portable Market

LUSTENAU, Austria—(BUSINESS WIRE)—Feb. 16, 2005— NewLogic Technologies, the leading supplier of intellectual property (IP) cores for wireless systems announces its new WiLD(TM)-Mobile WLAN IP solution optimized for portable consumer product applications such as mobile phones, MP3 players, digital still cameras and game consoles.

NewLogic is the only system IP provider who offers the whole WLAN IP solution, consisting of Software, MAC, Modem and Radio. NewLogic's WLAN IP is silicon-proven in CMOS and is available for licensing together with the related software stacks and extensions. The Radio is available as IP or can be supplied as IC by one of NewLogic's licensees.

The WiLD-Mobile MAC/Modem, when implemented in a low power 90 nm technology, draws 70 mW in Receive mode and 60 mW in Transmit mode, while the synthesized RTL excluding the memory only occupies 4.3 sq mm of die size. This high integration of the MAC/Modem combined with NewLogic's dual mode radio and its sub-$1 b/g BOM allows the addition of WLAN into a mobile platform at about half the cost and half the board-space when compared to an external WLAN IC solution.

NewLogic's WiLD-Mobile IP is targeted to the specific needs of the portable market. Building on the silicon proven WiLD IP, it is optimized for power consumption and for cost (small die size, small required PCB board space, low cost BOM), and offers Power-Amplifier dynamic biasing (the PA is optimally biased for lowest power on a per packet basis). NewLogic's WiLD-Mobile IP offers Bluetooth and cellular coexistence, increased sensitivity at lower data rates, support of Analog RSSI to reduce power, and optimization of its software stack in order to reduce silicon area.

The need for WLAN in the portable market is driven by applications such as Voice over IP (VoIP) and fast data links to private, public and corporate networks. Based on the recent Unlicensed Mobile Access (UMA) convergence initiative, mobile operators are already combining GSM/CDMA/UMTS with WLAN, with the first dual mode handset recently announced.

"The challenge for semiconductor providers addressing the portable market will be to seamlessly integrate WLAN with the other standards to offer a full system solution at low costs and very low power consumption" said Uwe Hering, Sr. VP Sales and Marketing of NewLogic. "Teaming up with WLAN chip suppliers is one option for cellular platform silicon providers but does not offer the ability to combine software stacks, drive integration, reduce cost and power, add differentiating features and retain full ownership. IP from NewLogic enables licensees to do so."

NewLogic's WLAN IP is built around a digital High Speed Serial interface (HiSS) between the WLAN modem and radio. As the A/D and D/A converters are part of the radio IC, there is no need to integrate complex mixed signal blocks into the SoC, enabling faster IP integration and improving yield of the SoC. In such an embedded WLAN solution the system memory and system CPU resources can be shared resulting in significant cost savings.

A recent FCC ruling allows radio module with digital interface to be approved once and then reused in multiple systems without the need for re-certification - which reduces cost and time to market.

NewLogic's WLAN IP solution supports Quality of Service (.11e), Security (.11i), Transmit Power Control and Dynamic Frequency Selection/Radar Detection (.11h) and the Japanese 4.9 GHz spectrum adaptation (.11j) extensions.

Combined with NewLogic's Bluetooth(R) IP and its excellent track-record in Design Services for mobile phone baseband and applications processors, NewLogic enables customers to efficiently offer fully embedded system solutions for different mobile standards and diverse portable platforms.

Demonstrations of NewLogic's innovative solutions can be given worldwide at customers facilities or in the NewLogic offices in Lustenau (Austria), Sophia-Antipolis (France) and Munich (Germany).

About NewLogic Technologies

NewLogic is headquartered in Lustenau, Austria, and is a leading global supplier of IEEE 802.11 Wireless LAN, Bluetooth intellectual property (IP) cores and other elements for the next generation cellular technology. A significant part of its business is providing analog and digital IC design services where the company has a wide range of expertise, including experience in developing complete 90 nm IC Designs.

All Trademarks are the property of their respective owners.



Contact:
NewLogic Technologies AG 
Phone: +43 5577 995-111 
Fax: + 43 5577 995-988 
Email: 
Email Contact
or
Media Relations Contact
Tanja Stehle
Phone: +43 5577 995-211
Fax: +43 5577 995-988
Email: 
Email Contact



Review Article Be the first to review this article
Aldec

 Advanced Asembly

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! SEMI’s Innovation for a Transforming World
intelThe Dominion of Design
by intel
The Long Game: Product and Security Assurance
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Setting a High Standard for Standards-Based IP
Jobs
Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Simulator UI Engineer - job post for Xilinx at San Jose, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Upcoming Events
Join Chipx2021 - at Tel Aviv Expo convention center Tel Aviv Israel - Jun 21 - 22, 2021
Innovation for a Transforming World -virtual Event at United States - Jul 13 - 14, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise