FLEX Taiwan 2019 to Showcase Flexible Electronics Innovations and Opportunities

TAIPEI, Taiwan – April 18, 2019 – The latest flexible hybrid electronics (FHE) technology, innovations and industry insights will take center stage at FLEX Taiwan, May 29-30, 2019, at the Taipei International Convention Center (TICC). Organized by FlexTech, a SEMI Strategic Association Partner, the one-day technical conference provides insights into market trends, innovative materials, advanced manufacturing technology and FHE application opportunities such as Smart clothing, MedTech and precision sports. Registration for FLEX Taiwan 2019 is now open.

Projected to reach US$77.3 billion* by 2029, the global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid growth are key application areas including wearables, robotics, telematics and industrial automation. The lightweight, ultra-thin and foldable features of flexible electronics are inspiring new applications beyond the capabilities of traditional silicon- or glass-based substrates.

Featuring 17 keynote speeches, FLEX Taiwan 2019 brings together leaders across the semiconductor, flat panel display, sensor and other industries. Academics, executives and researchers from leading organizations including Stanford University, Toyobo, Lionrock Batteries, PragmatIC, ITRI, ASE and imec.

For the past 18 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China. FLEX Taiwan provides a powerful platform for connecting with customers and, suppliers, future partners and academia to drive collaboration and uncover new opportunities.

* IDTechEx estimates

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org.



Contact:

SEMI Taiwan
Jamie Liao
+886-3-5601777, #310
Email Contact




Review Article Be the first to review this article
Aldec

Featured Video
Latest Blog Posts
Colin WallsEmbedded Software
by Colin Walls
Low power modes
Jobs
Lead Validation Engineer for Alcon Research, LLC. at Johns Creek, Georgia
Electrical Engineer for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Electrical Engineer ‐  ASIC Layout  for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Principal Software Engineer (Middleware) for Alcon Research, LLC. at Lake Forest, California
Nano-Optics Process Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Product Applications Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Upcoming Events
Embedded Systems Conference (ESC) Silicon Valley at San Jose Convention Center San Jose CA - Aug 27 - 29, 2019
PCB West 2019 at santa clara convention center Santa Clara CA - Sep 9 - 12, 2019
SEMICON Taiwan 2019 at TaiNEX Taipei Taiwan - Sep 18 - 20, 2019
MEMS & Imaging Sensors Summit at World Trade Center Grenoble France - Sep 25 - 27, 2019



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise