FLEX Taiwan 2019 to Showcase Flexible Electronics Innovations and Opportunities

TAIPEI, Taiwan – April 18, 2019 – The latest flexible hybrid electronics (FHE) technology, innovations and industry insights will take center stage at FLEX Taiwan, May 29-30, 2019, at the Taipei International Convention Center (TICC). Organized by FlexTech, a SEMI Strategic Association Partner, the one-day technical conference provides insights into market trends, innovative materials, advanced manufacturing technology and FHE application opportunities such as Smart clothing, MedTech and precision sports. Registration for FLEX Taiwan 2019 is now open.

Projected to reach US$77.3 billion* by 2029, the global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid growth are key application areas including wearables, robotics, telematics and industrial automation. The lightweight, ultra-thin and foldable features of flexible electronics are inspiring new applications beyond the capabilities of traditional silicon- or glass-based substrates.

Featuring 17 keynote speeches, FLEX Taiwan 2019 brings together leaders across the semiconductor, flat panel display, sensor and other industries. Academics, executives and researchers from leading organizations including Stanford University, Toyobo, Lionrock Batteries, PragmatIC, ITRI, ASE and imec.

For the past 18 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China. FLEX Taiwan provides a powerful platform for connecting with customers and, suppliers, future partners and academia to drive collaboration and uncover new opportunities.

* IDTechEx estimates

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org.



Contact:

SEMI Taiwan
Jamie Liao
+886-3-5601777, #310
Email Contact




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