ANSYS Achieves Certification for TSMC's Innovative System-on-Integrated-Chips (TSMC-SoIC™) Advanced 3D Chip Stacking Technology

TSMC and ANSYS enable 3D-IC reference flows for mutual customers to address multiphysics challenges

PITTSBURGH, April 24, 2019 — (PRNewswire) —   TSMC certified ANSYS (NASDAQ: ANSS) solutions for its innovative System-on-Integrated-Chips (TSMC-SoIC™) advanced 3D chip stacking technology. SoIC is an advanced interconnect technology for multi-die stacking on system-level integration using Through Silicon Via (TSV) and chip-on-wafer bonding process — enabling customers with greater power efficiency and performance for highly complex and demanding cloud and data center applications.

ANSYS, Inc. logo. (PRNewsFoto/ANSYS, Inc.)

ANSYS multiphysics solutions for SoIC enable multi-die co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis, and thermal and thermal-induced stress analysis.

In addition to SoIC certification, TSMC validated the reference flow for the latest Chip-on-Wafer-on-Substrate (CoWoS®) packaging technology using ANSYS® RedHawk™, ANSYS® RedHawk-CTA™, ANSYS® CMA™ and ANSYS® CSM™ and their corresponding chip models for system level analysis.

"We're pleased with the result of our collaboration with ANSYS in delivery of TSMC-SoIC™ technology reference flow, which empowers customers to address growing performance, reliability and power demands for cloud and data center applications," said Suk Lee, senior director, design infrastructure management division at TSMC. "The collaborative efforts combining ANSYS' comprehensive chip-package co-analysis solutions with TSMC SoIC advanced chip stacking technology address complex multiphysics challenges in 3D-IC packaging technologies."

"Our 3D-IC solutions address complex multiphysics challenges to meet the stringent power, performance, thermal and reliability requirements," said John Lee, general manager at ANSYS. "ANSYS' comprehensive chip aware system and system aware chip signoff solutions empower mutual customers to accelerate design convergence with greater confidence."

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit  www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries

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Media

Mary Kate Joyce

724.820.4368

marykate.joyce@ansys.com 

 


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Annette Arribas, IRC

724.820.3700

annette.arribas@ansys.com

 

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SOURCE ANSYS, Inc.

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Company Name: ANSYS, Inc., TSMC
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