ASMC 2019 Highlights Latest Advanced Manufacturing Strategies

SARATOGA SPRINGS, New York — May 6, 2019 — Celebrating its 30th anniversary,  the SEMI  Advanced Semiconductor Manufacturing Conference (ASMC 2019) kicks off today with more than 300 industry experts and executives delivering more than 30 hours of technical presentations on the latest advanced manufacturing strategies and methodologies. May 6-9, 2019, in Saratoga Springs, New York, ASMC 2019 is the leading international technical conference for improving the collective manufacturing expertise of the semiconductor industry. ASMC 2019  registration remains open.

Cutting-edge technologies such as artificial intelligence (AI), Internet of Things (IoT), 5G and machine learning are dramatically increasing demands on semiconductor manufacturing. Device makers, equipment and materials suppliers, and academics must respond by collaborating to develop new solutions. Technical presentations at ASMC highlight industry innovations with specific results and are published by IEEE, with select manuscripts republished in the  ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing

Part of the SEMI  Technology Leadership Series of the Americas, ASMC 2019 features a panel discussion titled Time to Yield vs. Time to Productivity: What Matters Most in the Age of More than Moore? with experts from  Applied MaterialsAxcelisGLOBALFOUNDRIESSkyWater Technology and  TechSearch International.

ASMC 2019 Keynotes

Robert Czetina,  Infineon Technologies Austria

Christine Dunbar,  GLOBALFOUNDRIES

Robert Maire,  Semiconductor Advisors

ASMC 2019 technical sessions include:

  • Advanced Metrology
  • Advanced Process Improvement
  • Advanced Materials and Photonics
  • Advanced Process Control
  • Contamination Free Manufacturing
  • Defect Inspection
  • Factory Optimization
  • Materials Integration and Photonics
  • Yield Management

ASMC 2019 also provides powerful networking opportunities including an interactive poster session (including student presentations) and receptions.

The conference is co-chaired by Chris Ebert of  Linde and Dr. Franz Heider of  Infineon Technologies Austria

Back by popular demand, the third year of  Women in Semiconductors program – held May 6 in conjunction with ASMC 2019 – will underscore the critical importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Registration is complimentary for ASMC attendees. Ellie Yieh, corporate vice president for Advanced Product Technology Development at  Applied Materials, will keynote.

ASMC 2019 is presented by SEMI with technical sponsors including  Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Electrons Packaging Society (EPS). Corporate sponsors include Applied Seals, Edwards, GreeneTweed, Inficon, KLA and NOVA.

For conference details, contact Margaret Kindling from SEMI at  Email Contact or 1.202.393.5552. Qualified members of the media should contact Scott Stevens for SEMI Americas at Email Contact for media registration information.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit  www.semi.org



Contacts:

SEMI
Michael Hall
1.408.943.7988
Email Contact

SEMI Americas
Scott Stevens
1.512.288.4050
Email Contact




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