eSilicon Revolutionizes Next-Generation System-In-Package Designs with ANSYS Multiphysics Solutions

Semiconductor leader achieving significant product performance, reliability and cost savings, accelerating products to market faster than ever

PITTSBURGH, May 30, 2019 — (PRNewswire) —   eSilicon is pioneering complex system-in-package designs with significantly increased speed, efficiency and production-proven accuracy thanks to ANSYS (NASDAQ: ANSS). eSilicon leverages ANSYS' industry-leading multiphysics simulation solutions to ensure silicon to system success — driving time-to-market acceleration for its high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure customers.

ANSYS, Inc. logo. (PRNewsFoto/ANSYS, Inc.)

Chip, package, board and system designers manage numerous multiphysics challenges that increase the risk of failure for advanced 2.5D packaging designs. Issues such as power integrity, signal integrity, reliability, electromagnetic cross-talk, thermal effects and thermal-induced mechanical stress pose significant hurdles for design closure and contribute to skyrocketing chip design costs.

ANSYS' industry-leading multiphysics simulation tools enable eSilicon to affordably model, verify and validate the physical, electrical and electromagnetic behavior of advanced FinFET chip, 2.5D package and board designs. Effectively performing these chip-aware system and system-aware chip analyses tames the complexity of system-in-package designs and drives silicon to system success.

"Analyzing power integrity, signal integrity, reliability, and on-chip/off-chip electromagnetic effects are critical for ensuring product success," said Tony Mastroianni, senior director, packaging design at eSilicon. "With ANSYS multiphysics simulations we can comprehensively tackle these tough challenges to drive innovation for our networking, data center, AI and 5G infrastructure customers."

"ANSYS' suite of multiphysics solutions are integral — and the only validation methodology available — to cost-effectively achieving power, performance, area and reliability goals for complex 2.5D designs," said John Lee, ANSYS vice president and general manager. "ANSYS delivers a complete multiphysics solution for eSilicon, providing detailed modeling with unmatched accuracy to ensure first-time silicon to system success, greatly mitigating their chip design expense and significantly expediting their products' path to market."

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit  www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries

Contact

Media

Mary Kate Joyce



724.820.4368



marykate.joyce@ansys.com





Investors

Annette N. Arribas, IRC



724.820.3700



annette.arribas@ansys.com

ANSS-G

Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/esilicon-revolutionizes-next-generation-system-in-package-designs-with-ansys-multiphysics-solutions-300856852.html

SOURCE ANSYS, Inc.

Contact:
Company Name: ANSYS, Inc., eSilicon
Web: http://www.ansys.com
Financial data for ANSYS, Inc., eSilicon




Review Article Be the first to review this article
Aldec

Featured Video
Jobs
Engineer Applications for Microchip at San Jose, California
Firmware Engineer for Western Digital at Colorado Springs, Colorado
Senior RF Design Engineer for Lockheed Martin at Chelmsford, Massachusetts
Electronics Component Engineer for Lockheed Martin at Huntsville, Alabama
Principal Engineer - ASIC Implementation for Microchip at Portland, Oregon
Principal Engineer, Firmware Engineering for Western Digital at Milpitas, California
Upcoming Events
NanoTech 2019 Conference and Expo at Boston MA - Jun 17 - 19, 2019
PCI-SIG DevCon US 2019 at santa clara convention center Santa Clara CA - Jun 18 - 19, 2019
2019 FLEX Korea at COEX Seoul Korea (South) - Jun 19 - 20, 2019
Sensors Expo & Conference 2019 at McEnery Convention Center San Jose CA - Jun 25 - 27, 2019



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise