Toshiba Launches New Family of Low Voltage Driven Photorelays

--Photorelays in tiny packages enable high-density assembly in test equipment applications--

TOKYO — (BUSINESS WIRE) — June 10, 2019Toshiba Electronic Devices & Storage Corporation (“Toshiba”), the industry leader in the miniaturization of cutting-edge photorelays, has introduced a family of five new photorelays housed in the industry’s smallest[1] package, the S-VSONR4 (2.0mm x 1.45mm). The new devices are suited for use in automatic test equipment, memory testers, SoC/LSI testers and probe cards. Shipments have already started.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190610005013/en/

Toshiba: TLP34xxSRL series and TLP34xxSRH series, housed in the industry's smallest package S-VSONR4 ...

Toshiba: TLP34xxSRL series and TLP34xxSRH series, housed in the industry's smallest package S-VSONR4. (Photo: Business Wire)

Both the TLP34xxSRL series (two devices) and TLP34xxSRH series (three devices) have input voltage driven characteristics. TLP3406SRL and TLP3407SRL support a DC voltage range of 1.8V (typ.) to 3.3V (typ.), while TLP3406SRH, TLP3407SRH and TLP3412SRH support a DC voltage range of 3.3V (typ.) to 5V (typ.), characteristics that enhance compatibility with today’s low voltage FPGAs.

The new photorelays are housed in tiny S-VSONR4 packages and require a mounting space of 2.9mm2, a footprint approximately 27% smaller than Toshiba’s previous generation package, the VSONR4 (2.75mm x 1.45mm). In addition, they all have a built-in input resistor, eliminating the need for an external input resistor, saving space. The tiny packaging and its space requirements will allow engineers to design smaller test boards, especially probe cards. It also allows increases in the number of photorelays on a board to achieve a higher density solution.

Despite their tiny package size, the new photorelays can drive large currents: up to 1.5A for the TLP3406SRx with an offstage voltage VOFF of 30V and an ON-state resistance Ron of 0.2Ω (max); and up to 1A for TLP3407SRx with a VOFF of 60V and Ron of 0.3Ω. TLP3412SRH can drive up to 0.4A (VOFF = 60V / Ron = 1.5Ω). This makes them highly suited to device power supply applications across a range of test equipment. All of the new devices have a guaranteed operating temperature range to 110 ℃ (max).

Features

  • The smallest package of any voltage input control photorelay: mount space 2.9mm2 (typ.) (as of June 4, 2019)
  • Two input voltages adopted for the control signal: DC 1.8V (typ.) and DC 3.3V (typ.)
  • VOFF supports 30V/60V, ION supports 0.4A to 1.5A.

Applications

  • Automatic test equipment (ATE), memory testers, SoC and LSI testers and probe cards
 

Main Specifications

(@Ta=25℃)

Part number   TLP3406SRH   TLP3406SRL   TLP3407SRH   TLP3407SRL   TLP3412SRH
DC system voltage V CC typ. (V) 3.3/5 1.8 3.3/5 1.8 3.3/5
Package S-VSONR4
Absolute

maximum

ratings

  OFF-state output terminal voltage V OFF (V) 30 30 60 60 60
ON-state current I ON (A) 1.5 1.5 1.0 1.0 0.4
ON-state current (pulsed) I ONP (A) 4.5 4.5 3.0 3.0 1.2
Electrical

characteristics

Operating voltage V FON max (V) 3 1.8 3 1.6 3
ON-state resistance R ON max (Ω) 0.2 0.2 0.3 0.3 1.5
Output capacitance C OFF typ. (pF) 120 80 120 80 20
OFF-state current I OFF max (nA)

@V OFF

1

(@20V)

1

(@20V)

1

(@50V)

1

(@50V)

1

(@60V)

Switching

characteristics

Turn-on time t ON max (ms) 2 2 2 2 0.5
Turn-off time t OFF max (ms) 1 1 1 1 0.5
Isolation

characteristics

Isolation voltage BV S min (Vrms) 500 500 500 500 500
Stock Check & Purchase  

Buy Online

 

Buy Online

 

Buy Online

 

Buy Online

 

Buy Online

 

1 | 2  Next Page »



Review Article Be the first to review this article
Aldec

Featured Video
Jobs
Embedded Firmware Engineer for FlexRadio at Austin, Texas
Firmware Engineer for Western Digital at Colorado Springs, Colorado
Engineer Applications for Microchip at San Jose, California
Hardware Design Engineer for FlexRadio at Austin, Texas
Electronics Component Engineer for Lockheed Martin at Huntsville, Alabama
Principal Engineer, Firmware Engineering for Western Digital at Milpitas, California
Upcoming Events
NanoTech 2019 Conference and Expo at Boston MA - Jun 17 - 19, 2019
PCI-SIG DevCon US 2019 at santa clara convention center Santa Clara CA - Jun 18 - 19, 2019
2019 FLEX Korea at COEX Seoul Korea (South) - Jun 19 - 20, 2019
Sensors Expo & Conference 2019 at McEnery Convention Center San Jose CA - Jun 25 - 27, 2019
TrueCircuits: IoTPLL



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise