Second Quarter 2019 Silicon Wafer Area Shipments Fall 2.2 Percent from First Quarter Levels

MILPITAS, Calif., July 23, 2019 — (PRNewswire) —  Worldwide silicon wafer area shipments totaled 2,983 million square inches in the second quarter of 2019, down 2.2 percent from the 3,051 million square inches shipped in the first quarter of the year and 5.6 percent lower than shipments during the same period in 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMI® connects 2,000+ member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. SEMI builds connections that help its members prosper, create new markets, and address common industry challenges together. Visit http://www.semi.org

"Global silicon wafer shipments are being impacted by the same headwinds that are facing the broader industry," said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering of Shin Etsu Handotai America. "While shipment area growth is currently subdued, the long-term outlook for the industry remains positive."

Silicon Area Shipment Trends - Semiconductor applications only

 

Millions of Square Inches

 

4Q2017

1Q2018

2Q2018

3Q2018

4Q2018

1Q2019

2Q2019

Total

2,977

3,084

3,160

3,255

3,234

3,051

2,983

Source: SEMI (www.semi.org), Jul 2019

All data cited in this release includes polished silicon wafers, such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

More information on the SEMI Worldwide Silicon Wafer Shipment Statistics are available on the SEMI website.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter.

Association Contact
Michael Hall, SEMI
Phone: 1.408.943.7988
Email:  Email Contact

 

 

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SOURCE SEMI

Contact:
Company Name: SEMI
Web: http://www.semi.org





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