Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership

Collaboration Will Build on Long-Standing Partnership to Further Accelerate Scientific and Business Innovation and Discovery

SANTA CLARA, Calif. — (BUSINESS WIRE) — August 5, 2019 — Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems. Building on the companies’ long-standing partnership in the data center, the multiyear global collaboration will speed the convergence of HPC and AI, creating solutions for organizations of all sizes.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190805005220/en/

Intel chief executive officer Bob Swan and Navin Shenoy, Intel executive vice president and general manager of the Data Center Group, meet with Lenovo chief executive officer Yuanqing Yang and Kirk Skaugen, executive vice president and president, Lenovo Data Center Group to sign multiyear global collaboration agreement. (Credit: Intel Corporation)

Intel chief executive officer Bob Swan and Navin Shenoy, Intel executive vice president and general manager of the Data Center Group, meet with Lenovo chief executive officer Yuanqing Yang and Kirk Skaugen, executive vice president and president, Lenovo Data Center Group to sign multiyear global collaboration agreement. (Credit: Intel Corporation)

Lenovo, the leading global system provider of TOP500 supercomputers will be optimizing Intel’s full portfolio of HPC and AI hardware and software solutions to serve as the foundation for its market strategy. Working together, the companies aim to accelerate the convergence of HPC and AI to unlock new levels of customer insight. The combination of 2nd Gen Intel® Xeon® Scalable platform and Lenovo Neptune™ liquid cooling technology has already produced remarkable results from joint engineering and utilizing a unique combination of HPC IP from the two companies. Today, 173 of the world’s TOP500 fastest supercomputers, spanning 19 markets run on Lenovo servers. Additionally, 17 of the world’s top 25 research universities rely on Lenovo infrastructure.

“Our goal is to further accelerate innovation into the Exascale era, aggressively waterfalling these solutions to scientists and businesses of all sizes to speed discovery and outcomes. We are passionate in helping researchers solve humanity’s greatest challenges,” said Kirk Skaugen, executive vice president of Lenovo and president of Lenovo Data Center Group. “Lenovo’s Neptune™ liquid cooling, in combination with the 2nd Gen Intel® Xeon® Scalable platform, helps customers unlock new insights and deliver unprecedented outcomes at new levels of energy efficiency.”

“Intel is laser-focused on helping our customers spur innovation and discovery through the convergence of AI with HPC,” said Navin Shenoy, Intel executive vice president and general manager of the Data Center Group. “Our extended collaboration with Lenovo combines the best of both companies’ innovations to drive our customers’ progress forward even faster.”

The collaboration plans to focus on three areas:

Systems and solutions: The collaboration brings together the best of Lenovo’s portfolio, including Lenovo TruScale Infrastructure™, and Intel’s leading-edge technologies, including Intel® Xe computing architecture; Intel® Optane™ DC persistent memory; Intel® oneAPI® programming framework; and both current and future generations of Intel® Xeon® Scalable processors, the only CPUs with the built-in AI acceleration of Intel® Deep Learning Boost. This partnership will be critical as breakthrough HPC and AI technologies are cascaded to users of any size, or what Lenovo calls “From Exascale to Everyscale™.”

Software optimization for HPC and AI convergence: A key focus area will be building out Lenovo’s smarter software offerings, including optimizing Lenovo’s LiCO HPC/AI software stack for Intel’s next-generation technologies, and alignment with the Intel oneAPI® programming framework. Additionally, the collaboration will work to enable DAOS advanced storage frameworks and other exascale-class software optimizations, targeted at helping HPC and AI users run their applications with greater ease than before.

Ecosystem enablement: Additionally, Intel and Lenovo plan to partner to help create the new ecosystem for the convergence of HPC and AI. This includes building joint “HPC & AI centers of excellence” around the world to further enable research and university centers to develop solutions that address some of the most pervasive world challenges, including genomics, cancer, weather and climate, space exploration and more.

About Intel

Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

About Lenovo

Lenovo (HKSE: 992) (ADR: LNVGY) is a US$50 billion Fortune Global 500 company and a global technology leader in driving Intelligent Transformation through smart devices and infrastructure that create the best user experience. Lenovo manufactures one of the world’s widest portfolio of connected products, including smartphones (Motorola), tablets, PCs (ThinkPad, Yoga, Lenovo Legion) and workstations as well as AR/VR devices and smart home/office solutions. Lenovo’s data center solutions (ThinkSystem, ThinkAgile) are creating the capacity and computing power for the connections that are changing business and society. Lenovo works to inspire the difference in everyone and build a smarter future where everyone thrives. Follow us on LinkedIn, Facebook, Twitter, Instagram, Weibo, read about the latest news via our Storyhub, or visit our website at https://www.lenovo.com/

Intel, Intel 2nd Gen Intel® Xeon® Scalable, Intel® Xe, Intel® Optane™ DC persistent memory, Intel® oneAPI®, Intel® Xeon® Scalable processors and Intel® Deep Learning Boost and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.



Contact:

Ann Goldmann
ann.goldmann@intel.com
503-702-2412




Review Article Be the first to review this article
Aldec

Featured Video
Latest Blog Posts
Colin WallsEmbedded Software
by Colin Walls
Low power modes
Jobs
Electrical Engineer ‐  ASIC Layout  for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Electrical Engineer for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Principal Software Engineer (Middleware) for Alcon Research, LLC. at Lake Forest, California
Product Applications Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Lead Validation Engineer for Alcon Research, LLC. at Johns Creek, Georgia
Nano-Optics Process Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Upcoming Events
Embedded Systems Conference (ESC) Silicon Valley at San Jose Convention Center San Jose CA - Aug 27 - 29, 2019
Tech Symposium on RISC-V at Hotel Daniel Herzlia Tel Aviv Israel - Sep 5, 2019
PCB West 2019 at santa clara convention center Santa Clara CA - Sep 9 - 12, 2019
SEMICON Taiwan 2019 at TaiNEX Taipei Taiwan - Sep 18 - 20, 2019



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise